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CDCLVP111MVFREP

Texas Instruments

CDCLVP111MVFREP by Texas Instruments

CDCLVP111MVFREP by Texas Instruments is a Clock Driver & Buffer with 0.355 ns propagation delay, 2.5V nominal voltage, and 32 terminals. It is used in applications requiring high-speed signal conditioning and offers differential mux input for precise synchronization. Ideal for military-grade systems operating b/w -55 to 125 °C.

Median Price

$49.970

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,502 parts In-Stock

1+ parts

$29.907

100+ parts

$26.584

1k+ parts

$19.547

10k+ parts

-

27,502

$29.907

$26.584

$19.547

-

Arrow

USA . 662 parts In-Stock

1+ parts

$49.970

100+ parts

$35.560

1k+ parts

$32.460

10k+ parts

-

662

$49.970

$35.560

$32.460

-

Verical

USA . 662 parts In-Stock

1+ parts

$49.970

100+ parts

$35.560

1k+ parts

$32.460

10k+ parts

-

662

$49.970

$35.560

$32.460

-

Mouser Electronics

USA . 432 parts In-Stock

1+ parts

$50.500

100+ parts

$37.300

1k+ parts

$34.250

10k+ parts

-

432

$50.500

$37.300

$34.250

-

Rochester

USA . 338 parts In-Stock

1+ parts

-

100+ parts

$32.310

1k+ parts

$28.910

10k+ parts

$27.210

338

-

$32.310

$28.910

$27.210

DigiKey

USA . 338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

338

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,497 parts In-Stock

1+ parts

$28.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,497

$28.240

-

-

-

Digiode

USA . 4,875 parts In-Stock

1+ parts

$28.412

100+ parts

-

1k+ parts

-

10k+ parts

-

4,875

$28.412

-

-

-

Chip Stock

USA . 5,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,200

-

-

-

-

DigiKey Marketplace

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

481

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 180 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

$0.089

180

$0.093

-

-

$0.089

Northwest PG Solutions

USA . 1,065 parts In-Stock

1+ parts

$0.102

100+ parts

-

1k+ parts

-

10k+ parts

$0.090

1,065

$0.102

-

-

$0.090

Andel Nordic

Denmark . 4,191 parts In-Stock

1+ parts

$7.333

100+ parts

-

1k+ parts

$7.040

10k+ parts

$7.040

4,191

$7.333

-

$7.040

$7.040

Ampacity Inc.

Singapore . 7,020 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

7,020

$24.000

-

-

-

Parana Technologies

USA . 1,496 parts In-Stock

1+ parts

$25.137

100+ parts

-

1k+ parts

$25.799

10k+ parts

-

1,496

$25.137

-

$25.799

-

Corphita

USA . 1,557 parts In-Stock

1+ parts

$26.916

100+ parts

-

1k+ parts

-

10k+ parts

-

1,557

$26.916

-

-

-

DigiPath Technology Company

USA . 2,355 parts In-Stock

1+ parts

$27.679

100+ parts

$25.465

1k+ parts

-

10k+ parts

-

2,355

$27.679

$25.465

-

-

ChromeModa Solutions

Germany . 2,613 parts In-Stock

1+ parts

$28.244

100+ parts

$23.160

1k+ parts

-

10k+ parts

-

2,613

$28.244

$23.160

-

-

IDEA Electronic Components Group

UK . 1,319 parts In-Stock

1+ parts

$28.244

100+ parts

$26.832

1k+ parts

$25.420

10k+ parts

-

1,319

$28.244

$26.832

$25.420

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Elevate your clock driver and buffer needs with the CDCLVP111MVFREP by Texas Instruments. Crafted with precision and expertise, this top-tier product ensures unparalleled performance and reliability. Ideal for various applications in the Clock Drivers & Buffers category, this innovative solution offers customers exceptional value, benefits, and advantages. Experience seamless operation and enhanced functionality with Texas Instruments' cutting-edge technology. Unlock a world of possibilities with the CDCLVP111MVFREP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a variety of applications.

Propagation Delay At Nominal Supply: 0.355 ns

Fast propagation delay ensures efficient performance and minimal signal delay.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Input Conditioning: DIFFERENTIAL MUX

Provides signal conditioning for accurate and reliable data transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage for consistent operation.

Maximum I (ol): 5 Amp

Capable of handling high output currents.

Temperature Grade: MILITARY

Suitable for use in rugged military applications with wide temperature ranges.

Minimum Supply Voltage (Vsup): 2.375 V

Can operate efficiently at lower supply voltages, saving energy.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage, ensuring product longevity.

Technical Specifications

Clock Drivers & Buffers CDCLVP111MVFREP attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Maximum I (ol):

5 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

.355 ns

Propagation Delay (tpd):

.355 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

3500 MHz

Trade Compliance

CDCLVP111MVFREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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