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CDCL6010RGZRG4

Texas Instruments

CDCL6010RGZRG4 by Texas Instruments

CDCL6010RGZRG4 clock driver by Texas Instruments operates at 1.8V, with 48 terminals in a square package style. It features differential input conditioning, 10 true outputs up to 1250MHz, and a max operating temperature of 85°C. Ideal for industrial applications requiring precise clock signal distribution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,487 parts In-Stock

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Digiode

USA . 4,937 parts In-Stock

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4,937

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Distributors (Availability)

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Native Components

USA . 613 parts In-Stock

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$0.061

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-

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$0.059

613

$0.061

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$0.059

AZTECH Wire

Italy . 716 parts In-Stock

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$9.118

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-

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716

$9.118

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Parana Technologies

USA . 1,915 parts In-Stock

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$14.569

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$15.007

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1,915

$14.569

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$15.007

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DigiPath Technology Company

USA . 1,681 parts In-Stock

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$16.043

100+ parts

$14.759

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1,681

$16.043

$14.759

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ChromeModa Solutions

Germany . 3,689 parts In-Stock

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$16.370

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$13.423

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3,689

$16.370

$13.423

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IDEA Electronic Components Group

UK . 1,806 parts In-Stock

1+ parts

$16.370

100+ parts

$15.552

1k+ parts

$14.733

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1,806

$16.370

$15.552

$14.733

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One Stop Electronics

USA . 446 parts In-Stock

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$34.000

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446

$34.000

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Corphita

USA . 2,639 parts In-Stock

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Microchip USA

USA . 1,765 parts In-Stock

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Northwest PG Solutions

USA . 1,534 parts In-Stock

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Overview

Unlock precise timing solutions with the CDCL6010RGZRG4 clock driver & buffer from Texas Instruments. Crafted with precision and quality, this product offers reliable performance in a wide range of applications. Designed for efficiency and ease of use, this chip carrier provides valuable benefits to customers looking for seamless clock distribution. With Texas Instruments' reputation for excellence, you can trust in the value and advantages that the CDCL6010RGZRG4 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product easy to handle and suitable for various applications.

Surface Mount: YES

Enables easy and convenient assembly onto circuit boards, saving time and effort during the manufacturing process.

Input Conditioning: DIFFERENTIAL

Provides better noise immunity and signal integrity, leading to reliable performance in demanding environments.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a standard voltage level, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat dissipation is critical.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold environments, adding versatility to the product's usage scenarios.

Minimum Supply Voltage (Vsup): 1.7 V

Works reliably even at lower voltage levels, providing flexibility in power supply options.

Technical Specifications

Clock Drivers & Buffers CDCL6010RGZRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

6010

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.064 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Minimum fmax:

1250 MHz

Trade Compliance

CDCL6010RGZRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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