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CDCE72010RGCT

Texas Instruments

CDCE72010RGCT by Texas Instruments

CDCE72010RGCT clock driver by Texas Instruments features 64 terminals, 3.4 ns propagation delay, and 10 true outputs. Ideal for industrial applications requiring a clock driver with a max operating temperature of 85°C and differential mux input conditioning. Package style is chip carrier with very thin profile, suitable for surface mount assembly.

Median Price

$16.997

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$14.220

100+ parts

$13.370

1k+ parts

$12.090

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3

$14.220

$13.370

$12.090

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Verical

USA . 176 parts In-Stock

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$15.130

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$14.400

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$15.130

$14.400

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Texas Instruments

USA . 21,334 parts In-Stock

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$16.997

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$14.847

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$10.239

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21,334

$16.997

$14.847

$10.239

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Arrow

USA . 183 parts In-Stock

1+ parts

$21.150

100+ parts

$13.440

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183

$21.150

$13.440

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Mouser Electronics

USA . 509 parts In-Stock

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$25.370

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$17.800

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$17.140

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509

$25.370

$17.800

$17.140

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DigiKey

USA . 282 parts In-Stock

1+ parts

$25.370

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$17.794

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$16.752

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282

$25.370

$17.794

$16.752

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Chip1Stop

Japan . 250 parts In-Stock

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$12.640

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250

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$12.640

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Distributors (In-Stock)

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$13.410

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900

$13.410

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Digiode

USA . 4,960 parts In-Stock

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$13.509

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$13.509

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Vyrian

USA . 3,986 parts In-Stock

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Bristol Electronics

USA . 250 parts In-Stock

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250

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Cyclops Electronics Ltd

UK . 241 parts In-Stock

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Elcom Components

USA . 15 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 7 parts In-Stock

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7

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Speed Components Ltd

Israel . 5 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 903 parts In-Stock

1+ parts

$4.167

100+ parts

-

1k+ parts

$4.001

10k+ parts

$4.001

903

$4.167

-

$4.001

$4.001

Ampacity Inc.

Singapore . 3,050 parts In-Stock

1+ parts

$10.740

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$10.740

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Corphita

USA . 1,689 parts In-Stock

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$12.798

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1,689

$12.798

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Netroflash

USA . 100 parts In-Stock

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$13.410

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100

$13.410

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Parana Technologies

USA . 2,158 parts In-Stock

1+ parts

$16.825

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$1,562.416

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$15.142

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2,158

$16.825

$1,562.416

$15.142

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DigiPath Technology Company

USA . 1,705 parts In-Stock

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$18.526

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$18.526

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ChromeModa Solutions

Germany . 3,052 parts In-Stock

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$18.904

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$15.501

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3,052

$18.904

$15.501

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IDEA Electronic Components Group

UK . 1,975 parts In-Stock

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$18.904

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$17.959

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$17.014

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$18.904

$17.959

$17.014

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Microchip USA

USA . 4,952 parts In-Stock

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$42.817

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Lixinc

USA . 6,870 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,718 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,145 parts In-Stock

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Kepictronics

USA . 1,630 parts In-Stock

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Perfect Parts

USA . 1,147 parts In-Stock

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Overview

Discover the superior performance and reliability of Texas Instruments' CDCE72010RGCT Clock Drivers & Buffers. Designed with precision and innovation, this product offers unmatched quality and efficiency in managing clock signals. Ideal for a wide range of applications, this chip carrier is perfect for industrial use, providing fast propagation delay and 3-state output characteristics. With a very thin profile and advanced technology, this clock driver ensures optimal performance and seamless integration into your projects. Trust Texas Instruments to deliver excellence with the CDCE72010RGCT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Input Conditioning: DIFFERENTIAL MUX

Enables precise signal processing and interference rejection, resulting in reliable performance.

Propagation Delay (tpd): 3.4 ns

Offers fast signal transmission, making this product suitable for high-speed applications.

Minimum Operating Temperature: -40 °C

Can operate effectively in harsh environmental conditions, increasing versatility.

No. of True Outputs: 10

Provides multiple output options, allowing for flexibility in signal distribution.

Minimum fmax: 1500 MHz

Supports high-frequency operation, making it suitable for advanced electronic systems.

Technical Specifications

Clock Drivers & Buffers CDCE72010RGCT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

72010

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

64

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.4 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

2.8 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Minimum fmax:

1500 MHz

Trade Compliance

CDCE72010RGCT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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