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CDC9161DL

Texas Instruments

CDC9161DL by Texas Instruments

The Texas Instruments CDC9161DL clock generator operates at 0-70°C, with power supplies of 2.5-3.3V. With a small outline package style and 48 terminals, it is ideal for commercial-grade applications requiring CMOS technology and surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,282 parts In-Stock

1+ parts

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5,282

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Digiode

USA . 2,312 parts In-Stock

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2,312

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 249 parts In-Stock

1+ parts

$10.337

100+ parts

-

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249

$10.337

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Native Components

USA . 23 parts In-Stock

1+ parts

$16.622

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-

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23

$16.622

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Northwest PG Solutions

USA . 1,999 parts In-Stock

1+ parts

$18.284

100+ parts

$16.455

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1,999

$18.284

$16.455

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One Stop Electronics

USA . 950 parts In-Stock

1+ parts

$31.000

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950

$31.000

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Parana Technologies

USA . 1,489 parts In-Stock

1+ parts

$41.161

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1,489

$41.161

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DigiPath Technology Company

USA . 60 parts In-Stock

1+ parts

$45.323

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60

$45.323

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ChromeModa Solutions

Germany . 3,437 parts In-Stock

1+ parts

$46.248

100+ parts

$37.923

1k+ parts

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3,437

$46.248

$37.923

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IDEA Electronic Components Group

UK . 1,930 parts In-Stock

1+ parts

$46.248

100+ parts

$43.936

1k+ parts

$41.623

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1,930

$46.248

$43.936

$41.623

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Corohmni

South Africa . 75 parts In-Stock

1+ parts

$61.281

100+ parts

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75

$61.281

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Corphita

USA . 890 parts In-Stock

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890

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Overview

Enhance your electronic projects with the CDC9161DL clock generator from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact rectangular package. Ideal for a wide range of applications, this clock generator offers customers unparalleled value and benefits. With precise power supplies and dual terminal positions, the CDC9161DL ensures optimal performance in commercial-grade settings. Trust Texas Instruments to provide you with the innovative solutions you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, saving board space and allowing for easier integration into electronic systems.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows for flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 48

The large number of terminals enables connectivity to a wide range of external components and peripherals, increasing the versatility of the product.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style enhances the product's portability and ease of integration in space-constrained applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand moderate heat levels, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C makes this product suitable for use in cold or fluctuating temperature conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, reducing the risk of data loss or signal interference.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliable performance and compatibility with standard operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable signal processing.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure connection to the PCB, enhancing the product's overall durability and reliability.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for high-density mounting and space-saving layout on the PCB, making it suitable for compact electronic devices.

Technical Specifications

Clock Generators CDC9161DL attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G48

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

CDC9161DL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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