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CDC922DL

Texas Instruments

CDC922DL by Texas Instruments

The Texas Instruments CDC922DL is a clock generator with 48 terminals, operating at a max frequency of 133 MHz. It has a supply voltage range of 2.375V to 2.625V and supports surface mount installation. Ideal for applications requiring precise timing such as processors and other digital systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,658 parts In-Stock

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4,658

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Digiode

USA . 233 parts In-Stock

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233

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 500 parts In-Stock

1+ parts

$0.805

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-

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500

$0.805

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Northwest PG Solutions

USA . 1,300 parts In-Stock

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$0.886

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$0.886

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AZTECH Wire

Italy . 375 parts In-Stock

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$15.699

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375

$15.699

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Parana Technologies

USA . 599 parts In-Stock

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$16.620

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$16.892

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599

$16.620

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$16.892

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DigiPath Technology Company

USA . 86 parts In-Stock

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$18.301

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86

$18.301

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ChromeModa Solutions

Germany . 4,739 parts In-Stock

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$18.674

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$15.313

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4,739

$18.674

$15.313

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IDEA Electronic Components Group

UK . 1,014 parts In-Stock

1+ parts

$18.674

100+ parts

$17.740

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$16.807

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1,014

$18.674

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$16.807

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Corohmni

South Africa . 60 parts In-Stock

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$20.871

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60

$20.871

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One Stop Electronics

USA . 714 parts In-Stock

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$31.000

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714

$31.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$47.665

100+ parts

$43.375

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$39.085

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2,000

$47.665

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$39.085

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Corphita

USA . 924 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments CDC922DL Clock Generator. Trusted for its superior quality and reliability, Texas Instruments is a leading manufacturer in the industry. The CDC922DL is perfect for a wide range of applications, providing precise clock signals essential for optimal performance. With a compact design and versatile functionality, this clock generator offers customers exceptional value and efficiency. Upgrade your projects with the CDC922DL and experience top-notch performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 2.625 V

The relatively low maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Maximum Output Clock Frequency: 133 MHz

The high output clock frequency enables fast data processing and communication, suitable for high-performance applications.

Power Supplies (V): 2.5, 3.3

Compatible with common power supply voltages, making it easy to integrate into existing systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the PCB, allowing for more components to be included in a design.

Maximum Operating Temperature: 85 °C

Operates effectively in a wide range of temperatures, suitable for various environments and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Clock Generators CDC922DL attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

JESD-30 Code:

R-PDSO-G48

Length:

15.875 mm

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

133 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Nominal Primary Clock/Crystal Frequency:

14.318 MHz

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

156 mA

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.49 mm

Trade Compliance

CDC922DL Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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