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CDC9171DBR

Texas Instruments

CDC9171DBR by Texas Instruments

CLOCK GENERATOR, OTHER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,802 parts In-Stock

1+ parts

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2,802

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Digiode

USA . 2,145 parts In-Stock

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2,145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 977 parts In-Stock

1+ parts

$3.064

100+ parts

-

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977

$3.064

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AZTECH Wire

Italy . 818 parts In-Stock

1+ parts

$5.277

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818

$5.277

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One Stop Electronics

USA . 1,010 parts In-Stock

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$29.000

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1,010

$29.000

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Parana Technologies

USA . 285 parts In-Stock

1+ parts

$33.909

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$137.206

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285

$33.909

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$137.206

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DigiPath Technology Company

USA . 430 parts In-Stock

1+ parts

$37.338

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430

$37.338

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IDEA Electronic Components Group

UK . 1,866 parts In-Stock

1+ parts

$38.100

100+ parts

$36.195

1k+ parts

$34.290

10k+ parts

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1,866

$38.100

$36.195

$34.290

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ChromeModa Solutions

Germany . 907 parts In-Stock

1+ parts

$38.100

100+ parts

$31.242

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907

$38.100

$31.242

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Corohmni

South Africa . 3,156 parts In-Stock

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$70.580

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$70.580

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Corphita

USA . 1,235 parts In-Stock

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Native Components

USA . 856 parts In-Stock

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$2.701

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856

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$2.701

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Technical Specifications

Clock Generators CDC9171DBR attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

8.2 mm

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

33.868 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Nominal Primary Clock/Crystal Frequency:

18.432 MHz

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

CDC9171DBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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