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CDC906PWG4

Texas Instruments

CDC906PWG4 by Texas Instruments

CDC906PWG4 by Texas Instruments is a clock generator with a max output frequency of 54 MHz and operates at supply voltages b/w 3V to 3.6V. It comes in a small outline package suitable for surface mount applications, making it ideal for commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,869 parts In-Stock

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Digiode

USA . 1,951 parts In-Stock

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SPM Sales

USA . 26 parts In-Stock

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Northwest PG Solutions

USA . 1,899 parts In-Stock

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$2.777

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$2.777

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AZTECH Wire

Italy . 520 parts In-Stock

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$13.082

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Advanced Electronics

New Zealand . 31 parts In-Stock

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$15.315

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$13.937

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$12.558

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One Stop Electronics

USA . 283 parts In-Stock

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$17.000

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Parana Technologies

USA . 1,058 parts In-Stock

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$23.612

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$24.246

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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$25.999

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$23.919

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ChromeModa Solutions

Germany . 3,437 parts In-Stock

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$26.530

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$21.755

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IDEA Electronic Components Group

UK . 1,050 parts In-Stock

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$26.530

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$25.204

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$23.877

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Corohmni

South Africa . 134 parts In-Stock

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Corphita

USA . 2,464 parts In-Stock

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Microchip USA

USA . 2,347 parts In-Stock

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Native Components

USA . 588 parts In-Stock

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$2.449

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Overview

Elevate your electronic devices with the CDC906PWG4 by Texas Instruments, a top-of-the-line clock generator that delivers unmatched precision and reliability. Crafted by the industry leader in semiconductor manufacturing, this cutting-edge product is designed to meet the demanding requirements of modern technology. Whether you're working on communication systems, networking equipment, or consumer electronics, this clock generator provides the perfect solution for achieving optimal performance. Trust in Texas Instruments to provide you with the quality and innovation you need to stay ahead of the competition. Discover the difference with the CDC906PWG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options without risking damage to the device.

Maximum Output Clock Frequency: 54 MHz

The high maximum output clock frequency ensures compatibility with a wide range of applications requiring precise timing.

Minimum Operating Temperature: 0 °C

The wide operating temperature range allows for reliable performance in various environmental conditions.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Clock Generators CDC906PWG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

54 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

54 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

115 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

CDC906PWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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