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CD74HCT240PW

Texas Instruments

CD74HCT240PW by Texas Instruments

CD74HCT240PW by Texas Instruments is a 20-terminal bus driver with 33ns propagation delay at 5V. It features 3-state output, inverted polarity, and enables low control type. Ideal for military-grade applications requiring CMOS technology in a small outline package.

Median Price

$0.674

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 44 parts In-Stock

1+ parts

$0.444

100+ parts

$0.407

1k+ parts

$0.351

10k+ parts

$0.304

44

$0.444

$0.407

$0.351

$0.304

DigiKey

USA . 740 parts In-Stock

1+ parts

$1.020

100+ parts

$0.604

1k+ parts

$0.523

10k+ parts

-

740

$1.020

$0.604

$0.523

-

Rochester

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.559

10k+ parts

$0.499

420

-

$0.674

$0.559

$0.499

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,028 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

-

4,028

$0.455

-

-

-

Vyrian

USA . 8,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,266

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 487 parts In-Stock

1+ parts

$0.041

100+ parts

-

1k+ parts

-

10k+ parts

$0.040

487

$0.041

-

-

$0.040

Corphita

USA . 4,331 parts In-Stock

1+ parts

$0.431

100+ parts

-

1k+ parts

-

10k+ parts

-

4,331

$0.431

-

-

-

Parana Technologies

USA . 994 parts In-Stock

1+ parts

$17.157

100+ parts

-

1k+ parts

$17.372

10k+ parts

-

994

$17.157

-

$17.372

-

DigiPath Technology Company

USA . 1,480 parts In-Stock

1+ parts

$18.891

100+ parts

$17.380

1k+ parts

-

10k+ parts

-

1,480

$18.891

$17.380

-

-

IDEA Electronic Components Group

UK . 1,086 parts In-Stock

1+ parts

$19.277

100+ parts

$18.313

1k+ parts

$17.349

10k+ parts

-

1,086

$19.277

$18.313

$17.349

-

ChromeModa Solutions

Germany . 3 parts In-Stock

1+ parts

$19.277

100+ parts

$15.807

1k+ parts

-

10k+ parts

-

3

$19.277

$15.807

-

-

Microchip USA

USA . 2,990 parts In-Stock

1+ parts

$45.440

100+ parts

$44.790

1k+ parts

$44.460

10k+ parts

$44.140

2,990

$45.440

$44.790

$44.460

$44.140

QUARKTWIN TECHNOLOGY LTD

USA . 7,051 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,051

-

-

-

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Northwest PG Solutions

USA . 1,148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,148

-

-

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Perfect Parts

USA . 1,019 parts In-Stock

1+ parts

-

100+ parts

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1,019

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Overview

Enhance your electronic designs with the Texas Instruments CD74HCT240PW bus driver and transceiver. Crafted with precision and excellence, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this component provides seamless integration and superior performance. Experience the value of efficiency and innovation with the CD74HCT240PW, delivering benefits that will elevate your projects to new heights. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external factors, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 33 ns

The low propagation delay ensures fast and efficient data transmission, making this product ideal for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy and compact installation, saving space and making it convenient for integration into different systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is standard and widely compatible, making this product versatile and suitable for a variety of applications.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in controlling signals, making it versatile and adaptable to different signal requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers CD74HCT240PW attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW OUTPUT ENABLES

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

33 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD74HCT240PW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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