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CD74HC4046APWRG4

Texas Instruments

CD74HC4046APWRG4 by Texas Instruments

CD74HC4046APWRG4 by Texas Instruments is a Phase Locked Loop (PLL) IC with 16 terminals and a supply voltage range of 2-6V. It operates in temperatures from -55 to 125°C, making it suitable for military-grade applications. This CMOS technology-based IC is designed for frequency synthesis circuits requiring precise control over signal synchronization.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,409 parts In-Stock

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Digiode

USA . 2,746 parts In-Stock

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Bristol Electronics

USA . 162 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Semicontronic

India . 1,421 parts In-Stock

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$1.500

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$1.462

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$1.455

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One Stop Electronics

USA . 566 parts In-Stock

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$3.500

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 276 parts In-Stock

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$9.070

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$12.226

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$11.126

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$10.025

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Parana Technologies

USA . 1,131 parts In-Stock

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$16.288

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$16.595

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DigiPath Technology Company

USA . 1,341 parts In-Stock

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$17.935

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Corohmni

South Africa . 474 parts In-Stock

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ChromeModa Solutions

Germany . 5,646 parts In-Stock

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$18.301

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$15.007

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IDEA Electronic Components Group

UK . 1,421 parts In-Stock

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$18.301

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$17.386

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Perfect Parts

USA . 2,240 parts In-Stock

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Microchip USA

USA . 1,852 parts In-Stock

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Corphita

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Argo Parts USA

USA . 790 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Discover the cutting-edge CD74HC4046APWRG4 by Texas Instruments, a top-tier manufacturer renowned for its high-quality Phase Locked Loops (PLL) & Frequency Synthesis Circuits. This innovative product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From precision frequency synthesis to advanced signal processing, this product delivers exceptional value, benefits, and advantages to customers seeking top-of-the-line solutions. Upgrade your systems with Texas Instruments' CD74HC4046APWRG4 and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and thermal stability, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy integration and compact design, saving space in electronic devices.

Nominal Supply Voltage (Vsup): 3 V

Operates at a common supply voltage, making it compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring stable performance even in challenging environments.

Minimum Operating Temperature: -55 °C

Operates in a wide temperature range, suitable for various industrial and outdoor applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD74HC4046APWRG4 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

CD74HC4046APWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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