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CD74HC32MTG4

Texas Instruments

CD74HC32MTG4 by Texas Instruments

CD74HC32MTG4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 27ns at 5V, making it suitable for high-speed applications. With a small outline package style and surface mount capability, it is ideal for compact electronic designs.

Median Price

$22.563

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$22.563

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100

$22.563

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Vyrian

USA . 8,663 parts In-Stock

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8,663

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Digiode

USA . 490 parts In-Stock

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490

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Distributors (Availability)

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AZTECH Wire

Italy . 402 parts In-Stock

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$12.186

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402

$12.186

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Parana Technologies

USA . 1,635 parts In-Stock

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$20.838

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$21.009

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$20.838

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$21.009

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DigiPath Technology Company

USA . 1,750 parts In-Stock

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$22.946

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$21.110

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$22.946

$21.110

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ChromeModa Solutions

Germany . 2,070 parts In-Stock

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$23.414

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$19.199

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2,070

$23.414

$19.199

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IDEA Electronic Components Group

UK . 1,555 parts In-Stock

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$23.414

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$22.243

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$21.073

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$23.414

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$21.073

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Ampacity Inc.

Singapore . 627 parts In-Stock

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$56.000

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One Stop Electronics

USA . 1,537 parts In-Stock

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$64.000

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Microchip USA

USA . 12,440 parts In-Stock

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Corphita

USA . 4,841 parts In-Stock

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Bastille Electronics

Australia . 900 parts In-Stock

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Overview

Unlock the power of logic gates with the CD74HC32MTG4 by Texas Instruments. With a reputation for superior quality and reliability, Texas Instruments delivers top-notch products that exceed industry standards. Logic gates play a crucial role in digital electronics, offering a wide range of applications from simple switching to complex data processing. The CD74HC32MTG4 provides fast propagation delay and low power consumption, making it an ideal choice for your projects. Trust in Texas Instruments for unmatched performance and value in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the logic gates, ensuring reliability in various operating conditions.

Propagation Delay At Nominal Supply: 27 ns

The fast propagation delay at nominal supply voltage ensures quick response times in logic operations, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto PCBs, saving space and simplifying the assembly process.

No. of Functions: 4

Having 4 functions in one package offers versatility and flexibility in designing complex logic circuits without the need for multiple components.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in a wide range of environments, making this product suitable for industrial or automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making these logic gates efficient and reliable for various digital applications.

Technical Specifications

Logic Gates CD74HC32MTG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC32MTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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