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CD74HC273ME4

Texas Instruments

CD74HC273ME4 by Texas Instruments

CD74HC273ME4 by Texas Instruments is an 8-bit latch with a propagation delay of 45ns. It operates at a supply voltage range of 2-6V and has a max frequency of 20MHz. Ideal for military-grade applications, this CMOS technology-based flip-flop is surface mountable and features positive edge triggering.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,288 parts In-Stock

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Digiode

USA . 1,664 parts In-Stock

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Native Components

USA . 620 parts In-Stock

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$2.127

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Northwest PG Solutions

USA . 446 parts In-Stock

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$2.340

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AZTECH Wire

Italy . 717 parts In-Stock

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$11.318

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One Stop Electronics

USA . 537 parts In-Stock

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$23.000

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Parana Technologies

USA . 319 parts In-Stock

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$28.177

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$44.580

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DigiPath Technology Company

USA . 1,444 parts In-Stock

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$31.026

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ChromeModa Solutions

Germany . 6,330 parts In-Stock

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$31.659

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$25.960

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IDEA Electronic Components Group

UK . 1,875 parts In-Stock

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$30.076

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$28.493

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Microchip USA

USA . 3,584 parts In-Stock

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Corphita

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Overview

Enhance your electronic projects with the CD74HC273ME4 by Texas Instruments, a top-of-the-line latch and flip-flop component that delivers unrivaled quality and reliability. With a focus on innovation and precision engineering, Texas Instruments ensures that each product meets the highest standards in the industry. Ideal for a wide range of applications, this versatile component offers customers unmatched value, benefits, and advantages. Experience seamless performance and superior functionality with the CD74HC273ME4 - the perfect choice for all your electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 45 ns

The low propagation delay ensures that the latch & flip-flop responds quickly to input changes, making it efficient for time-sensitive operations.

Surface Mount: YES

Being surface mountable, this product is easy to install on PCBs, saving space and providing a more streamlined design.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V, this latch & flip-flop is energy-efficient while still providing reliable performance.

No. of Bits: 8

With 8 bits, this latch & flip-flop can store and operate on a wide range of digital information, making it versatile for different applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that this latch & flip-flop can withstand and operate in various environmental conditions.

Technology: CMOS

Using CMOS technology, this latch & flip-flop offers low power consumption and high noise immunity, making it an efficient and reliable choice for digital circuits.

Technical Specifications

Latches & Flip-Flops CD74HC273ME4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC273ME4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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