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CD74HC237PWE4

Texas Instruments

CD74HC237PWE4 by Texas Instruments

CD74HC237PWE4 by Texas Instruments is a 16-terminal decoder with 48ns propagation delay, suitable for military applications. It operates at supply voltages of 2-6V, has a load capacitance of 50pF, and features latched input conditioning. The package is small outline with a thin profile and shrink pitch.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,914 parts In-Stock

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Digiode

USA . 2,568 parts In-Stock

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AZTECH Wire

Italy . 497 parts In-Stock

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$7.486

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Parana Technologies

USA . 747 parts In-Stock

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DigiPath Technology Company

USA . 1,335 parts In-Stock

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ChromeModa Solutions

Germany . 6,268 parts In-Stock

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

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$10.901

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One Stop Electronics

USA . 1,398 parts In-Stock

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Component Stockers USA

USA . 342 parts In-Stock

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Corphita

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Microchip USA

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Northwest PG Solutions

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Native Components

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD74HC237PWE4, a versatile decoder and driver that is perfect for a wide range of applications. With its fast propagation delay and latched input conditioning, this product offers exceptional performance and precision. Whether you're working on industrial automation, consumer electronics, or telecommunications, this decoder and driver will provide unparalleled value and convenience. Trust Texas Instruments for cutting-edge technology that delivers outstanding results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the decoder & drivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 48 ns

Low propagation delay ensures fast response time, making this decoder & drivers suitable for high-speed applications where speed is crucial.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving time and effort during assembly.

Input Conditioning: LATCHED

Latched input conditioning ensures that input signals are held stable until the decoder processes them, reducing the risk of errors or data corruption.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a moderate supply voltage, making it compatible with a wide range of power sources and applications.

Load Capacitance (CL): 50 pF

Low load capacitance minimizes power consumption and heat generation, improving overall efficiency and performance.

Power Supplies (V): 2/6

Compatibility with multiple power supply voltages allows for versatile and flexible integration into different systems and setups.

Maximum I (ol): 4 Amp

High output current capacity allows the decoder & drivers to drive heavy loads or multiple components simultaneously without overheating or damage.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product efficient and reliable for various applications.

Technical Specifications

Decoder & Drivers CD74HC237PWE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ADDRESS LATCHES; 3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD74HC237PWE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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