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CD74HC237M96G4

Texas Instruments

CD74HC237M96G4 by Texas Instruments

CD74HC237M96G4 by Texas Instruments is an 8-bit decoder with 36ns propagation delay, latch input conditioning, and 50pF load capacitance. It operates at a nominal voltage of 4.5V and is suitable for military-grade applications requiring true output polarity in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,651 parts In-Stock

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Digiode

USA . 4,193 parts In-Stock

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Ashlea Components Ltd

UK . 1,170 parts In-Stock

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Native Components

USA . 339 parts In-Stock

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$0.284

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$0.273

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Northwest PG Solutions

USA . 2,336 parts In-Stock

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$0.312

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$0.276

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Parana Technologies

USA . 1,186 parts In-Stock

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$8.472

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$9.120

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ChromeModa Solutions

Germany . 1,369 parts In-Stock

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$9.519

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$7.806

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IDEA Electronic Components Group

UK . 1,014 parts In-Stock

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$9.519

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$9.043

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$8.567

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AZTECH Wire

Italy . 696 parts In-Stock

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$13.531

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One Stop Electronics

USA . 1,339 parts In-Stock

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$38.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,399 parts In-Stock

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Microchip USA

USA . 4,521 parts In-Stock

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Perfect Parts

USA . 2,800 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 1,028 parts In-Stock

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$8.582

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Overview

Unlock the potential of your electronics with the Texas Instruments CD74HC237M96G4 Decoder & Drivers. With a reputation for excellence in the industry, Texas Instruments delivers a high-quality product that offers reliability and precision. Ideal for a variety of applications, this product provides seamless decoding and driving functions. Experience the value and benefits of this decoder & drivers chip, designed to enhance the performance of your devices. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long-term usage.

Propagation Delay At Nominal Supply: 36 ns

Low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability improves ease of installation and allows for compact and space-saving designs.

Input Conditioning: LATCHED

Latched input conditioning ensures signal stability and reliability, making the product suitable for critical operations.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into circuit layouts and provides a standard form factor for compatibility.

No. of Bits: 8

With 8 bits, this decoder and driver offer a wide range of input/output options, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for consistent performance and reliable operation.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal signal distortion and improves overall signal integrity for precise output control.

Power Supplies (V): 2/6

Support for dual power supplies at 2V and 6V offers flexibility in voltage requirements and compatibility with different systems.

No. of Terminals: 16

With 16 terminals, this decoder and driver provide ample connectivity options for interfacing with other components and peripherals.

Technical Specifications

Decoder & Drivers CD74HC237M96G4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ADDRESS LATCHES; 3 ENABLE INPUTS

Family:

HC

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC237M96G4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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