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CD74ACT86MDREP

Texas Instruments

CD74ACT86MDREP by Texas Instruments

CD74ACT86MDREP by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 14.6 ns at a nominal voltage of 5V, making it suitable for high-speed applications in military-grade environments. This surface-mount device features a small outline package style and operates within a wide temperature range from -55°C to 125°C.

Median Price

$1.485

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,359 parts In-Stock

1+ parts

$1.510

100+ parts

$1.440

1k+ parts

$1.371

10k+ parts

-

2,359

$1.510

$1.440

$1.371

-

Chip1Stop

Japan . 2,378 parts In-Stock

1+ parts

$1.770

100+ parts

$1.463

1k+ parts

$1.130

10k+ parts

-

2,378

$1.770

$1.463

$1.130

-

Verical

USA . 2,359 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.371

10k+ parts

-

2,359

-

$1.440

$1.371

-

Adafruit Industries

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

-

Rochester

USA . 174 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.310

10k+ parts

$1.230

174

-

$1.460

$1.310

$1.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$0.987

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$0.987

-

-

-

Digiode

USA . 704 parts In-Stock

1+ parts

$1.294

100+ parts

-

1k+ parts

-

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704

$1.294

-

-

-

Vyrian

USA . 2,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.967

100+ parts

-

1k+ parts

$0.928

10k+ parts

-

2,000

$0.967

-

$0.928

-

Ampacity Inc.

Singapore . 1,176 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$1.150

-

-

-

Corphita

USA . 3,433 parts In-Stock

1+ parts

$1.226

100+ parts

-

1k+ parts

-

10k+ parts

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3,433

$1.226

-

-

-

AZTECH Wire

Italy . 336 parts In-Stock

1+ parts

$11.110

100+ parts

-

1k+ parts

-

10k+ parts

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336

$11.110

-

-

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Parana Technologies

USA . 1,744 parts In-Stock

1+ parts

$23.108

100+ parts

-

1k+ parts

$23.747

10k+ parts

-

1,744

$23.108

-

$23.747

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DigiPath Technology Company

USA . 1,215 parts In-Stock

1+ parts

$25.445

100+ parts

$23.409

1k+ parts

-

10k+ parts

-

1,215

$25.445

$23.409

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IDEA Electronic Components Group

UK . 2,353 parts In-Stock

1+ parts

$25.964

100+ parts

$24.666

1k+ parts

$23.368

10k+ parts

-

2,353

$25.964

$24.666

$23.368

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ChromeModa Solutions

Germany . 1,754 parts In-Stock

1+ parts

$25.964

100+ parts

$21.290

1k+ parts

-

10k+ parts

-

1,754

$25.964

$21.290

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-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,171 parts In-Stock

1+ parts

-

100+ parts

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8,171

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Perfect Parts

USA . 4,785 parts In-Stock

1+ parts

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4,785

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Overview

Elevate your electronic projects with the CD74ACT86MDREP by Texas Instruments, a high-quality logic gate that promises reliability and performance. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled precision and efficiency. Ideal for a wide range of applications, this logic gate features 4 functions and 2 inputs, making it versatile for various projects. Experience the value and benefits of this product, from its fast propagation delay to its compact design and military-grade temperature rating. Upgrade your circuits today with the CD74ACT86MDREP and unlock endless possibilities in electronics.

Feature Benefit Bullets

Package Body Material

This material provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply

The low propagation delay ensures fast and efficient signal processing in the circuit.

Surface Mount

The surface mount feature allows for easy and convenient installation on PCBs.

No. of Functions

With multiple functions in one package, this product offers versatility and space-saving benefits.

No. of Inputs

With two inputs, this product can effectively handle a variety of input signals.

Package Shape

The rectangular shape of the package allows for efficient use of space on the PCB.

Nominal Supply Voltage / Vsup (V)

This ensures compatibility with standard 5V power supplies, making integration simple.

Load Capacitance (CL)

The low load capacitance helps in reducing signal distortion and improving overall performance.

Power Supplies (V)

The 5V power supply ensures stable operation and compatibility with common power sources.

No. of Terminals

With 14 terminals, this product offers flexibility in connecting to other components.

Package Style (Meter)

The small outline package style saves space on the PCB, ideal for compact designs.

Maximum I (ol)

With a high maximum output current, this product can drive heavy loads with ease.

Maximum Operating Temperature

The high maximum operating temperature ensures reliability in a variety of environments.

Minimum Operating Temperature

The low minimum operating temperature allows for use in extreme cold conditions.

Terminal Finish

The terminal finish provides corrosion resistance and excellent conductivity for reliable connections.

Terminal Position

The dual terminal position offers flexibility in layout and installation on the PCB.

Maximum Seated Height

The low seated height allows for compact and slim designs.

Width

The narrow width of the package contributes to space-saving on the PCB.

Minimum Supply Voltage (Vsup)

With a low minimum supply voltage, this product can operate efficiently even with slightly lower power sources.

Maximum Time At Peak Reflow Temperature (s)

The maximum time at peak reflow temperature allows for proper soldering and reliability during assembly.

Peak Reflow Temperature °C

The high peak reflow temperature ensures proper soldering and durability of the component.

Length

The length of the package provides a compact and efficient design for PCB layouts.

Temperature Grade

The military temperature grade ensures high reliability and performance in harsh environments.

Technology

CMOS technology offers low power consumption and fast switching speed for efficient operation.

Terminal Form

The gull wing terminal form provides secure and reliable connections during installation.

Packing Method

The TR packing method ensures safe and secure transportation and storage of the product.

Terminal Pitch

The standard terminal pitch allows for easy connections and compatibility with various PCB layouts.

Maximum Supply Voltage (Vsup)

With a high maximum supply voltage, this product offers a wide operating range for flexibility in different applications.

Maximum Power Supply Current (ICC)

The low maximum power supply current ensures energy efficiency and minimal power consumption.

Technical Specifications

Logic Gates CD74ACT86MDREP attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

14.6 ns

Propagation Delay (tpd):

14.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74ACT86MDREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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