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CD4046BH

Texas Instruments

CD4046BH by Texas Instruments

CD4046BH by Texas Instruments is a Phase Locked Loop (PLL) IC with 16 terminals and CMOS technology. It operates b/w -55°C to 125°C, suitable for military-grade applications. With a supply voltage range of 5V to 18V, it offers precise frequency synthesis in various electronic systems.

Median Price

$3.827

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 21 parts In-Stock

1+ parts

$3.827

100+ parts

$4.018

1k+ parts

$3.788

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21

$3.827

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$3.788

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Vyrian

USA . 8,133 parts In-Stock

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Digiode

USA . 2,203 parts In-Stock

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2,203

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Electronics Depot

USA . 62 parts In-Stock

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Electronic Expediters

USA . 40 parts In-Stock

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40

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Distributors (Availability)

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Native Components

USA . 489 parts In-Stock

1+ parts

$6.150

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489

$6.150

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AZTECH Wire

Italy . 527 parts In-Stock

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$6.545

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527

$6.545

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One Stop Electronics

USA . 626 parts In-Stock

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$7.500

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626

$7.500

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Parana Technologies

USA . 920 parts In-Stock

1+ parts

$15.839

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$16.198

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920

$15.839

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$16.198

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DigiPath Technology Company

USA . 1,391 parts In-Stock

1+ parts

$17.441

100+ parts

$16.046

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1,391

$17.441

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ChromeModa Solutions

Germany . 4,826 parts In-Stock

1+ parts

$17.797

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$14.594

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4,826

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IDEA Electronic Components Group

UK . 1,849 parts In-Stock

1+ parts

$17.797

100+ parts

$16.907

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$16.017

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1,849

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Corphita

USA . 4,547 parts In-Stock

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4,547

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Northwest PG Solutions

USA . 2,170 parts In-Stock

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$6.027

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2,170

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Supply Digital

USA . 2,116 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality CD4046BH Phase Locked Loop from Texas Instruments. With a military-grade temperature range and advanced CMOS technology, this surface-mount chip offers precise frequency synthesis capabilities for a wide range of applications. Whether you're designing communication systems, audio equipment, or control circuits, this versatile component ensures reliable performance in any environment. Trust Texas Instruments to deliver top-notch products that meet your needs and exceed your expectations. Elevate your designs with the CD4046BH PLL and experience unparalleled value and efficiency in your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, reducing assembly time and making it a convenient choice for electronic devices.

Nominal Supply Voltage (Vsup): 10 V

Operating at a nominal supply voltage of 10V provides stability and reliable performance for the PLL & Frequency Synthesis Circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and maintain functionality in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the PLL & Frequency Synthesis Circuits energy-efficient and reliable.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits CD4046BH attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-XUUC-N16

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

CD4046BH Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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