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CD4042BPWR

Texas Instruments

CD4042BPWR by Texas Instruments

CD4042BPWR by Texas Instruments is a 4-bit latch with 220 ns propagation delay, suitable for military applications. It operates at supply voltages of 5/15V, has a temperature range of -55 to 125°C, and features negative edge triggering. The package is small outline with dual terminals and gull wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,635 parts In-Stock

1+ parts

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5,635

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Digiode

USA . 1,601 parts In-Stock

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1,601

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Distributors (Availability)

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Native Components

USA . 430 parts In-Stock

1+ parts

$0.252

100+ parts

-

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$0.242

430

$0.252

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-

$0.242

Northwest PG Solutions

USA . 1,719 parts In-Stock

1+ parts

$0.277

100+ parts

-

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$0.244

1,719

$0.277

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$0.244

AZTECH Wire

Italy . 538 parts In-Stock

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$8.705

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538

$8.705

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Parana Technologies

USA . 2,376 parts In-Stock

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$12.021

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$12.427

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2,376

$12.021

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$12.427

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DigiPath Technology Company

USA . 608 parts In-Stock

1+ parts

$13.237

100+ parts

$12.178

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608

$13.237

$12.178

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ChromeModa Solutions

Germany . 3,472 parts In-Stock

1+ parts

$13.507

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$11.076

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$13.507

$11.076

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IDEA Electronic Components Group

UK . 1,714 parts In-Stock

1+ parts

$13.507

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$12.832

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$12.156

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$13.507

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$12.156

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One Stop Electronics

USA . 1,213 parts In-Stock

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$47.000

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Corphita

USA . 4,405 parts In-Stock

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Microchip USA

USA . 4,013 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD4042BPWR latch and flip-flop. Designed for a wide range of applications, this product offers exceptional value and performance. With a compact design and advanced technology, customers can trust in the high-quality construction and dependable operation of this device. Upgrade your electronics with the CD4042BPWR and discover the benefits of Texas Instruments innovation today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch & flip-flop lightweight and durable, suitable for various electronic applications.

Propagation Delay At Nominal Supply: 220 ns

The low propagation delay ensures fast signal processing in the latch & flip-flop, making it efficient for time-critical applications.

Surface Mount: YES

Being surface mountable, this latch & flip-flop can be easily installed on PCBs, saving space and minimizing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on circuit boards, enhancing the overall design and layout of the electronic system.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this latch & flip-flop is compatible with standard electronic systems and can be easily integrated into existing setups.

Load Capacitance (CL): 50 pF

With a low load capacitance, this latch & flip-flop can efficiently drive external components without significant signal degradation, ensuring reliable performance.

Power Supplies (V): 5/15

The latch & flip-flop can operate with dual power supplies of 5V and 15V, offering flexibility in voltage requirements for different applications.

No. of Terminals: 16

Having 16 terminals enables versatile connectivity options and integration with other components, making this latch & flip-flop suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim design of the package allows for efficient use of space on the PCB, making it ideal for applications where board real estate is limited.

Propagation Delay (tpd): 500 ns

Despite a slightly higher propagation delay, the latch & flip-flop maintains a balance between speed and stability, ensuring reliable signal processing and transition times.

Maximum Operating Temperature: 125 °C

Operating at a high temperature range of up to 125°C, this latch & flip-flop is suitable for industrial and military applications where extended temperature tolerance is required.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type ensures accurate and precise signal triggering, reducing the risk of timing errors and enhancing overall system performance.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature of -55°C, this latch & flip-flop can withstand harsh environmental conditions and is suitable for outdoor or rugged applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout and connectivity options, allowing for easy integration of the latch & flip-flop into different electronic systems.

Maximum Seated Height: 1.2 mm

With a low seated height, this latch & flip-flop can be used in space-constrained applications where component height is a critical factor.

Width: 4.4 mm

The compact width of the latch & flip-flop allows for efficient placement on the PCB and minimizes space requirements, making it suitable for compact electronic designs.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies signal processing and logic operations, enhancing the versatility and compatibility of the latch & flip-flop with other components.

Minimum Supply Voltage (Vsup): 3 V

With a low minimum supply voltage requirement of 3V, this latch & flip-flop can operate efficiently even in low-voltage environments, expanding its usability in various applications.

Length: 5 mm

The short length of the latch & flip-flop allows for compact placement on the PCB, optimizing space utilization and improving the overall design aesthetics of the electronic system.

Temperature Grade: MILITARY

Designed with military-grade temperature tolerance, this latch & flip-flop is suitable for defense and aerospace applications where reliability and resilience under extreme conditions are paramount.

Technology: CMOS

Utilizing CMOS technology, this latch & flip-flop offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for energy-efficient and high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form ensures reliable solder connections and secure attachment to the PCB, enhancing the overall durability and robustness of the latch & flip-flop.

Packing Method: TR

The TR packing method provides efficient storage and handling of multiple latch & flip-flop units, facilitating easy inventory management and assembly processes.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, this latch & flip-flop allows for dense PCB layouts and precise soldering, enabling high circuit density and miniaturization in electronic designs.

Maximum Supply Voltage (Vsup): 18 V

Capable of operating at a maximum supply voltage of 18V, this latch & flip-flop offers versatility in voltage compatibility and can withstand voltage spikes or fluctuations, ensuring robust performance in varied operating conditions.

Technical Specifications

Latches & Flip-Flops CD4042BPWR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

PROGRAMMABLE TRIGGER TYPE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

220 ns

Propagation Delay (tpd):

500 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Width:

4.4 mm

Trade Compliance

CD4042BPWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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