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CD4010BMT

Texas Instruments

CD4010BMT by Texas Instruments

CD4010BMT by Texas Instruments is a logic gate with 6 functions, 200 ns propagation delay at 5V, and open-drain output. It operates in temperatures from -55 to 125°C, suitable for military-grade applications. This small outline package has a terminal pitch of 1.27mm and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,971 parts In-Stock

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4,971

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Vyrian

USA . 3,505 parts In-Stock

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3,505

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 513 parts In-Stock

1+ parts

$13.334

100+ parts

-

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$13.845

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513

$13.334

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$13.845

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DigiPath Technology Company

USA . 308 parts In-Stock

1+ parts

$14.682

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308

$14.682

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ChromeModa Solutions

Germany . 5,680 parts In-Stock

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$14.982

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$12.285

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5,680

$14.982

$12.285

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IDEA Electronic Components Group

UK . 231 parts In-Stock

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$14.982

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$14.233

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$13.484

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231

$14.982

$14.233

$13.484

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AZTECH Wire

Italy . 238 parts In-Stock

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$16.447

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238

$16.447

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One Stop Electronics

USA . 1,385 parts In-Stock

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$42.000

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$42.000

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Corphita

USA . 3,803 parts In-Stock

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Microchip USA

USA . 2,679 parts In-Stock

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Northwest PG Solutions

USA . 906 parts In-Stock

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$3.346

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906

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$3.346

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Native Components

USA . 51 parts In-Stock

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$3.312

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51

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$3.312

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Overview

Enhance your electronic projects with the high-quality CD4010BMT logic gates from Texas Instruments. Known for their reliability and precision, Texas Instruments delivers top-notch components that guarantee optimal performance. The CD4010BMT is versatile and can be used in a variety of applications, making it a must-have for any DIY enthusiast or professional engineer. With fast propagation delay and open-drain output characteristics, this product offers exceptional value and benefits, ensuring seamless operation and efficient functionality. Upgrade your projects today with the CD4010BMT and experience the superior quality that Texas Instruments is renowned for.

Feature Benefit Bullets

Nominal Supply Voltage / Vsup (V): 5

A low nominal supply voltage of 5V makes this product energy-efficient and suitable for low-power applications.

Propagation Delay (tpd): 200 ns

The fast propagation delay of 200 ns ensures quick signal processing, making this product suitable for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product reliable and efficient in various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability, ensuring secure connections in the circuit.

Temperature Grade: MILITARY

The military-grade temperature rating allows this product to operate reliably in harsh environmental conditions, making it suitable for rugged applications.

Technical Specifications

Logic Gates CD4010BMT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

200 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4010BMT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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