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CC400-RTR2

Texas Instruments

CC400-RTR2 by Texas Instruments

CC400-RTR2 by Texas Instruments is a telecom IC with 28 terminals, operating at 3V. It has a data rate of 0.0096 Mbps and operates b/w -30 to 85 °C. Ideal for telecom applications requiring small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,212 parts In-Stock

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Digiode

USA . 1,906 parts In-Stock

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1,906

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Distributors (Availability)

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Native Components

USA . 937 parts In-Stock

1+ parts

$0.183

100+ parts

-

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$0.176

937

$0.183

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$0.176

Northwest PG Solutions

USA . 1,982 parts In-Stock

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$0.201

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$0.177

1,982

$0.201

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$0.177

Parana Technologies

USA . 1,668 parts In-Stock

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$10.095

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$10.644

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1,668

$10.095

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$10.644

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ChromeModa Solutions

Germany . 6,075 parts In-Stock

1+ parts

$11.343

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$9.301

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6,075

$11.343

$9.301

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IDEA Electronic Components Group

UK . 1,881 parts In-Stock

1+ parts

$11.343

100+ parts

$10.776

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$10.209

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1,881

$11.343

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$10.209

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AZTECH Wire

Italy . 853 parts In-Stock

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$12.339

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853

$12.339

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One Stop Electronics

USA . 443 parts In-Stock

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$169.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 450 parts In-Stock

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DigiPath Technology Company

USA . 83 parts In-Stock

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$10.227

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Overview

Upgrade your telecom systems with the CC400-RTR2 by Texas Instruments, a top-quality telecom interface IC that delivers reliable performance and seamless connectivity. Manufactured by industry leader Texas Instruments, this product offers exceptional value, benefits, and advantages for your communication needs. With its small outline package style and dual terminal position, this versatile IC is perfect for a wide range of applications in the telecom industry. Enhance your communication systems with the CC400-RTR2 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape is a common and standard form factor, making it compatible with a wide range of devices and applications.

Power Supplies (V): 3

Operating at a voltage of 3V makes this IC suitable for low power applications, reducing energy consumption.

No. of Terminals: 28

Having 28 terminals provides flexibility in connectivity options and allows for versatile usage scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30°C enables operation in cold environments without any issues, increasing the product's versatility.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved signal integrity, enhancing the overall performance of the IC.

Maximum Seated Height: 2 mm

A low maximum seated height of 2mm allows for compact design and space-saving integration within electronic devices.

Width: 5.3 mm

Narrow width of 5.3mm enables easy placement and routing of the IC on PCBs, optimizing space utilization.

Length: 10.2 mm

The moderate length of 10.2mm provides a balance between compactness and functionality, making it suitable for various applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and handling during assembly, ensuring a reliable connection with the PCB.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type, this IC is designed specifically for telecommunications applications, offering optimized performance in such scenarios.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources and simplifies system design.

Terminal Pitch: 0.65 mm

A small terminal pitch of 0.65mm allows for high-density mounting and increased connectivity options in compact PCB layouts.

Data Rate: 0.0096 Mbps

Supporting a data rate of 0.0096 Mbps, this IC is suitable for moderate speed telecom applications, providing efficient data transmission.

Technical Specifications

Other Function Telecom Interface ICs CC400-RTR2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.0096 Mbps

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

CC400-RTR2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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