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CC400-RTB2

Texas Instruments

CC400-RTB2 by Texas Instruments

The Texas Instruments CC400-RTB2 is a telecom interface IC with 28 terminals, operating at temperatures from -30°C to 85°C. It has a supply voltage of 3V and features a small outline package style for surface mount applications. The terminal pitch is 0.635mm, making it suitable for various communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,778 parts In-Stock

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Digiode

USA . 2,633 parts In-Stock

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2,633

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Distributors (Availability)

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Native Components

USA . 829 parts In-Stock

1+ parts

$0.132

100+ parts

-

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$0.127

829

$0.132

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$0.127

Northwest PG Solutions

USA . 1,738 parts In-Stock

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$0.146

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$0.129

1,738

$0.146

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$0.129

AZTECH Wire

Italy . 529 parts In-Stock

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$10.172

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529

$10.172

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Parana Technologies

USA . 1,756 parts In-Stock

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$10.768

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$11.251

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1,756

$10.768

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$11.251

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ChromeModa Solutions

Germany . 6,382 parts In-Stock

1+ parts

$12.099

100+ parts

$9.921

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6,382

$12.099

$9.921

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IDEA Electronic Components Group

UK . 7 parts In-Stock

1+ parts

$12.099

100+ parts

$11.494

1k+ parts

$10.889

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7

$12.099

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$10.889

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One Stop Electronics

USA . 1,399 parts In-Stock

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$789.000

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$789.000

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Corphita

USA . 3,481 parts In-Stock

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DigiPath Technology Company

USA . 1,774 parts In-Stock

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$10.908

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1,774

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$10.908

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Overview

Upgrade your telecom systems with the CC400-RTB2 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for all your communication needs. Designed for efficiency and performance, this product offers seamless integration and exceptional functionality. Whether you're in need of a reliable interface IC for your telecommunications projects or looking to enhance your existing systems, the CC400-RTB2 provides unparalleled value and benefits. Trust Texas Instruments to deliver top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making this product easy to handle and resistant to impact or environmental damage.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and simplifying the manufacturing process.

Power Supplies (V): 3

Operating at 3V provides compatibility with a wide range of devices and power sources, making this product versatile and widely compatible.

No. of Terminals: 28

Having 28 terminals allows for a greater number of connections and functionalities, enabling more complex telecom interface operations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable and reliable performance even in rigorous or demanding operating conditions.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30°C allows for usage in a wide range of environments, including cold climates or industrial settings.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures optimal performance and energy efficiency, making this product an ideal choice for telecom applications.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm provides high density and precision in connections, allowing for compact design and efficient use of space on circuit boards.

Technical Specifications

Other Function Telecom Interface ICs CC400-RTB2 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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