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CC3200R1M2RGC

Texas Instruments

CC3200R1M2RGC by Texas Instruments

The Texas Instruments CC3200R1M2RGC is a 32-bit microcontroller with 64 terminals, operating at temperatures from -40 to 85°C. It features 262144 bytes of RAM, 65536 ROM words, and 4 ADC channels. Ideal for industrial applications requiring I2C, SPI, UART connectivity and PWM capabilities.

Median Price

$15.290

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,864 parts In-Stock

1+ parts

$10.307

100+ parts

$9.003

1k+ parts

$6.209

10k+ parts

-

2,864

$10.307

$9.003

$6.209

-

Mouser Electronics

USA . 234 parts In-Stock

1+ parts

$15.290

100+ parts

$11.670

1k+ parts

$10.300

10k+ parts

-

234

$15.290

$11.670

$10.300

-

DigiKey

USA . 183 parts In-Stock

1+ parts

$15.750

100+ parts

$12.020

1k+ parts

$11.004

10k+ parts

-

183

$15.750

$12.020

$11.004

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.761

100+ parts

-

1k+ parts

-

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10

$7.761

-

-

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Digiode

USA . 203 parts In-Stock

1+ parts

$9.792

100+ parts

-

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203

$9.792

-

-

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Tomark Electronics Ltd

UK . 1,005 parts In-Stock

1+ parts

$17.050

100+ parts

-

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-

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1,005

$17.050

-

-

-

Vyrian

USA . 7,197 parts In-Stock

1+ parts

-

100+ parts

-

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-

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7,197

-

-

-

-

Chip Stock

USA . 905 parts In-Stock

1+ parts

-

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-

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905

-

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Semi Source

USA . 5 parts In-Stock

1+ parts

-

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-

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5

-

-

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Bristol Electronics

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

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5

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$7.761

100+ parts

$7.373

1k+ parts

-

10k+ parts

$6.907

300

$7.761

$7.373

-

$6.907

Continental Prestige Electronics

USA . 1,977 parts In-Stock

1+ parts

$7.761

100+ parts

-

1k+ parts

-

10k+ parts

$7.606

1,977

$7.761

-

-

$7.606

Corphita

USA . 2,467 parts In-Stock

1+ parts

$9.276

100+ parts

-

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-

10k+ parts

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2,467

$9.276

-

-

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Ampacity Inc.

Singapore . 932 parts In-Stock

1+ parts

$19.070

100+ parts

-

1k+ parts

-

10k+ parts

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932

$19.070

-

-

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Parana Technologies

USA . 1,062 parts In-Stock

1+ parts

$31.578

100+ parts

-

1k+ parts

$82.901

10k+ parts

-

1,062

$31.578

-

$82.901

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DigiPath Technology Company

USA . 1,096 parts In-Stock

1+ parts

$34.771

100+ parts

$31.990

1k+ parts

-

10k+ parts

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1,096

$34.771

$31.990

-

-

ChromeModa Solutions

Germany . 686 parts In-Stock

1+ parts

$35.481

100+ parts

$29.094

1k+ parts

-

10k+ parts

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686

$35.481

$29.094

-

-

IDEA Electronic Components Group

UK . 223 parts In-Stock

1+ parts

$35.481

100+ parts

$33.707

1k+ parts

$31.933

10k+ parts

-

223

$35.481

$33.707

$31.933

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$39.825

100+ parts

$36.241

1k+ parts

$32.656

10k+ parts

-

3,000

$39.825

$36.241

$32.656

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Corohmni

South Africa . 305 parts In-Stock

1+ parts

$82.327

100+ parts

-

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305

$82.327

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Lixinc

USA . 18,483 parts In-Stock

1+ parts

-

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18,483

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Perfect Parts

USA . 10,483 parts In-Stock

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10,483

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Argo Parts USA

USA . 4,254 parts In-Stock

1+ parts

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4,254

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S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

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3,000

-

-

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Futuretech Components

Singapore . 780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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780

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Overview

Unlock limitless possibilities with the Texas Instruments CC3200R1M2RGC microcontroller. Crafted with precision and expertise, this device offers unparalleled quality and reliability for a wide range of applications. Whether you're delving into IoT projects or developing innovative solutions, this microcontroller provides seamless connectivity and advanced features to bring your ideas to life. Experience the value and benefits of cutting-edge technology with the CC3200R1M2RGC, where performance meets innovation.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides reliability and durability to the product.

Surface Mount:

YES. Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage:

3.6 V. Ensures compatibility with a range of power sources.

Package Shape:

SQUARE. Facilitates efficient use of space on the PCB.

Bit Size:

32. Offers high processing power and capability.

No. of Terminals:

64. Provides plenty of connection options for external components.

Package Style:

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE. Ensures efficient heat dissipation and compact design.

Minimum Supply Voltage:

2.1 V. Allows for operation in low power scenarios.

Maximum Operating Temperature:

85 °C. Suitable for industrial environments with varying temperatures.

Minimum Operating Temperature:

40 °C. Ensures reliable operation even in extreme cold conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au). Provides corrosion resistance and long-term reliability.

ADC Channels:

YES. Enables analog to digital conversion for accurate data processing.

DMA Channels:

YES. Facilitates efficient data transfer without CPU intervention.

Terminal Position:

QUAD. Simplifies PCB layout and routing.

ROM Words:

65536. Offers ample storage for firmware and data.

Maximum Seated Height:

1 mm. Allows for compact and slim device designs.

Width:

9 mm. Helps in determining form factor and board layout.

Peripherals:

DMA(32), POR, PWM, RTC, TIMER(4), WDT. Provides versatile and essential peripheral functions for various applications.

Peak Reflow Temperature:

260 C. Enables secure soldering during production.

Length:

9 mm. Contributes to overall dimensions and placement considerations.

Temperature Grade:

INDUSTRIAL. Ensures reliable operation in harsh conditions.

Peripheral IC Type:

MICROCONTROLLER, RISC. Indicates efficient processing and control capabilities.

RAM Bytes:

262144. Offers high memory capacity for data storage and processing.

Technology:

CMOS. Provides low power consumption and high noise immunity.

Terminal Form:

NO LEAD. Enables lead-free manufacturing and environmental compliance.

Analog To Digital Convertors:

4-Ch 12-Bit. Allows for multiple analog input conversions with high resolution.

Nominal Supply Voltage:

3.3 V. Standard voltage for compatibility with various components.

PWM Channels:

YES. Supports pulse width modulation for precise control of connected devices.

Connectivity:

I2C, I2S(2), SD, SPI, UART(2). Offers multiple communication options for interfacing with other devices.

ROM Programmability:

FLASH. Enables flexible and fast reprogramming of firmware.

Terminal Pitch:

0.5 mm. Determines the spacing between terminals for PCB layout.

Moisture Sensitivity Level (MSL):

3. Indicates the level of protection needed during storage and handling.

Speed:

80 rpm. Specifies the processing speed for efficient operation.

On Chip Program ROM Width:

8. Determines the data bus width for program execution.

No. of I/O Lines:

27. Provides ample input/output options for external connections.

Technical Specifications

Microcontrollers CC3200R1M2RGC attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

HAVING 40MHZ CRYSTAL FREQUENCY WITH +/-20PPM ACCURACY.

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S(2), SD, SPI, UART(2)

Peripherals:

DMA(32), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

CC3200R1M2RGC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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