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CC3235MODASM2MONR

Texas Instruments

CC3235MODASM2MONR by Texas Instruments

The Texas Instruments CC3235MODASM2MONR is a 32-bit microcontroller with 262144 RAM bytes, PWM and ADC channels, and DMA support. It operates b/w -40 to 85°C, suitable for industrial applications requiring TIMER and WDT peripherals in a compact rectangular package.

Median Price

$23.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,002 parts In-Stock

1+ parts

$16.416

100+ parts

$14.339

1k+ parts

$9.889

10k+ parts

-

4,002

$16.416

$14.339

$9.889

-

Mouser Electronics

USA . 2,805 parts In-Stock

1+ parts

$23.310

100+ parts

$17.890

1k+ parts

$16.170

10k+ parts

-

2,805

$23.310

$17.890

$16.170

-

DigiKey

USA . 1,646 parts In-Stock

1+ parts

$23.310

100+ parts

$17.882

1k+ parts

$16.160

10k+ parts

-

1,646

$23.310

$17.882

$16.160

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$12.590

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$12.590

-

-

-

Digiode

USA . 1,066 parts In-Stock

1+ parts

$15.595

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$15.595

-

-

-

Vyrian

USA . 2,571 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,571

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,589 parts In-Stock

1+ parts

$12.590

100+ parts

-

1k+ parts

-

10k+ parts

$12.338

6,589

$12.590

-

-

$12.338

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$12.590

100+ parts

$12.338

1k+ parts

-

10k+ parts

-

2,000

$12.590

$12.338

-

-

Advanced Electronics

New Zealand . 90 parts In-Stock

1+ parts

$12.832

100+ parts

$12.832

1k+ parts

$12.832

10k+ parts

-

90

$12.832

$12.832

$12.832

-

Ampacity Inc.

Singapore . 2,294 parts In-Stock

1+ parts

$13.950

100+ parts

-

1k+ parts

-

10k+ parts

-

2,294

$13.950

-

-

-

Semicontronic

India . 2,285 parts In-Stock

1+ parts

$13.950

100+ parts

$13.601

1k+ parts

$13.532

10k+ parts

-

2,285

$13.950

$13.601

$13.532

-

Corphita

USA . 4,792 parts In-Stock

1+ parts

$14.774

100+ parts

-

1k+ parts

-

10k+ parts

-

4,792

$14.774

-

-

-

Parana Technologies

USA . 1,562 parts In-Stock

1+ parts

$47.985

100+ parts

-

1k+ parts

-

10k+ parts

-

1,562

$47.985

-

-

-

DigiPath Technology Company

USA . 2,192 parts In-Stock

1+ parts

$52.838

100+ parts

$48.611

1k+ parts

-

10k+ parts

-

2,192

$52.838

$48.611

-

-

ChromeModa Solutions

Germany . 1,022 parts In-Stock

1+ parts

$53.916

100+ parts

$44.211

1k+ parts

-

10k+ parts

-

1,022

$53.916

$44.211

-

-

IDEA Electronic Components Group

UK . 356 parts In-Stock

1+ parts

$53.916

100+ parts

$51.220

1k+ parts

$48.524

10k+ parts

-

356

$53.916

$51.220

$48.524

-

Corohmni

South Africa . 13 parts In-Stock

1+ parts

$58.779

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$58.779

-

-

-

Lixinc

USA . 19,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,702

-

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,000

-

-

-

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Argo Parts USA

USA . 1,280 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,280

-

-

-

-

Overview

Unlock the power of innovation with the CC3235MODASM2MONR by Texas Instruments, a top-tier microcontroller designed to take your projects to the next level. As a leader in the industry, Texas Instruments guarantees unmatched quality and reliability in every product they create. Ideal for a wide range of applications, this microcontroller offers exceptional value and benefits to customers looking to streamline their processes and boost efficiency. Say goodbye to limitations and hello to endless possibilities with the CC3235MODASM2MONR.

Feature Benefit Bullets

Surface Mount: YES

Ideal for compact designs and efficient PCB layout.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications without the risk of overloading.

Package Shape: RECTANGULAR

Easy to handle and incorporate into electronic systems.

Bit Size: 32

Offers high processing capability for complex tasks.

No. of Terminals: 63

Provides ample connectivity options for peripherals and external components.

Package Style: MICROELECTRONIC ASSEMBLY

Ensures reliability and durability in harsh environments.

Minimum Supply Voltage: 2.3 V

Allows for operation in power-constrained scenarios.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature ranges.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions.

Terminal Finish: NICKEL GOLD

Enhances conductivity and corrosion resistance for long-term use.

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing.

DMA Channels: YES

Facilitates efficient data transfer without CPU intervention.

Maximum Seated Height: 2.4 mm

Low profile design for space-constrained applications.

Width: 20.5 mm

Compact form factor for versatility in design.

Peripherals: TIMER, WDT

Includes essential functionalities for precise timing and watchdog capabilities.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes for assembly.

Length: 25 mm

Balanced dimensions for integration into various projects.

Temperature Grade: INDUSTRIAL

Designed to meet the demands of rugged industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

Employs efficient RISC architecture for optimized performance.

RAM Bytes: 262144

Offers ample memory for data storage and multitasking capabilities.

Technology: CMOS

Energy-efficient technology for longer battery life.

Terminal Form: NO LEAD

Lead-free composition for environmental friendliness.

Nominal Supply Voltage: 3.3 V

Standard voltage for compatibility with common power sources.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

Terminal Pitch: 1.27 mm

Standard spacing for easy soldering and signal routing.

Moisture Sensitivity Level (MSL): 3

Resistant to moisture damage during handling and storage.

Speed: 80 rpm

Capable of high-speed processing for real-time applications.

No. of I/O Lines: 27

Sufficient I/O options for interfacing with external devices.

Technical Specifications

Microcontrollers CC3235MODASM2MONR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS 40MHZ CRYSTAL

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-XXMA-N63

JESD-609 Code:

e4

Length:

25 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Terminals:

63

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

Maximum Seated Height:

2.4 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

UNSPECIFIED

Width:

20.5 mm

Peripheral IC Type:

Peripherals:

TIMER, WDT

Trade Compliance

CC3235MODASM2MONR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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