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CC3200R1M1RGC

Texas Instruments

CC3200R1M1RGC by Texas Instruments

The Texas Instruments CC3200R1M1RGC is a 32-bit microcontroller with 131072 bytes of RAM and 65536 ROM words. It features 4-Ch 12-Bit ADC channels, PWM support, and connectivity options like I2C, I2S, SD, SPI, and UART for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,397 parts In-Stock

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8,397

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Digiode

USA . 3,072 parts In-Stock

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3,072

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Distributors (Availability)

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Northwest PG Solutions

USA . 615 parts In-Stock

1+ parts

$3.201

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615

$3.201

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One Stop Electronics

USA . 1,265 parts In-Stock

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$6.000

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1,265

$6.000

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AZTECH Wire

Italy . 571 parts In-Stock

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$7.687

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571

$7.687

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Parana Technologies

USA . 253 parts In-Stock

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$43.396

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253

$43.396

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DigiPath Technology Company

USA . 1,376 parts In-Stock

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$47.784

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1,376

$47.784

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ChromeModa Solutions

Germany . 4,250 parts In-Stock

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$48.759

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$39.982

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$48.759

$39.982

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IDEA Electronic Components Group

UK . 1,803 parts In-Stock

1+ parts

$48.759

100+ parts

$46.321

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$43.883

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1,803

$48.759

$46.321

$43.883

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A-Z Elektronik GmbH

Germany . 5,156 parts In-Stock

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Corphita

USA . 4,702 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,437 parts In-Stock

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Native Components

USA . 625 parts In-Stock

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$2.823

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625

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$2.823

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Overview

Experience the cutting-edge technology of the CC3200R1M1RGC by Texas Instruments, a top-tier manufacturer known for its quality microcontrollers. This versatile product offers a wide range of applications in various industries, providing customers with reliable and efficient performance. With advanced features such as ADC channels, DMA channels, and PWM capabilities, this microcontroller is designed to meet your specific needs. Trust Texas Instruments to deliver value, benefits, and advantages that will enhance your projects and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount option makes it easy to integrate the microcontroller onto PCBs, saving space and simplifying manufacturing processes.

Bit Size: 32

32-bit architecture allows for high-performance computing and efficient data processing.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for various peripherals and external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer versatility in mounting options and thermal management, ideal for compact and high-performance applications.

Maximum Operating Temperature: 85 °C

Operating up to 85°C ensures reliability in industrial applications where high temperatures may be encountered.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient instruction execution and reduced power consumption, making this microcontroller suitable for power-sensitive applications.

RAM Bytes: 131072

With 131072 bytes of RAM, the microcontroller can handle complex computations and multitasking efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interface with analog sensors and input devices, expanding its application capabilities.

Technical Specifications

Microcontrollers CC3200R1M1RGC attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

HAVING 40MHZ CRYSTAL FREQUENCY WITH +/-20PPM ACCURACY.

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S(2), SD, SPI, UART(2)

Peripherals:

DMA(32), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

CC3200R1M1RGC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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