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CC3200R1M1RGCR

Texas Instruments

CC3200R1M1RGCR by Texas Instruments

The Texas Instruments CC3200R1M1RGCR is a 32-bit microcontroller with 131072 bytes of RAM and 65536 ROM words. It features 4 ADC channels, 32 DMA channels, and connectivity options like I2C, SPI, and UART. Ideal for industrial applications requiring a temperature range of -40 to 85°C with a compact square package style.

Median Price

$8.589

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,497 parts In-Stock

1+ parts

$8.589

100+ parts

$7.502

1k+ parts

$5.174

10k+ parts

-

19,497

$8.589

$7.502

$5.174

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,418 parts In-Stock

1+ parts

$8.160

100+ parts

-

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1,418

$8.160

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Vyrian

USA . 4,258 parts In-Stock

1+ parts

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4,258

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 468 parts In-Stock

1+ parts

$7.730

100+ parts

-

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468

$7.730

-

-

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AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$15.110

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157

$15.110

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Parana Technologies

USA . 1,055 parts In-Stock

1+ parts

$62.935

100+ parts

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1,055

$62.935

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ChromeModa Solutions

Germany . 4,213 parts In-Stock

1+ parts

$70.713

100+ parts

$57.985

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-

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4,213

$70.713

$57.985

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IDEA Electronic Components Group

UK . 1,603 parts In-Stock

1+ parts

$70.713

100+ parts

$67.177

1k+ parts

$63.642

10k+ parts

-

1,603

$70.713

$67.177

$63.642

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A-Z Elektronik GmbH

Germany . 6,050 parts In-Stock

1+ parts

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6,050

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Alle Elektronik GmbH

Germany . 4,033 parts In-Stock

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4,033

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Northwest PG Solutions

USA . 1,846 parts In-Stock

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1,846

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DigiPath Technology Company

USA . 1,355 parts In-Stock

1+ parts

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$63.755

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1,355

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$63.755

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Native Components

USA . 588 parts In-Stock

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588

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments CC3200R1M1RGCR microcontroller. Manufactured by a trusted industry leader, this high-quality product offers unparalleled performance and reliability for a wide range of applications. With advanced features like ADC channels, DMA channels, and PWM capabilities, this microcontroller provides customers with increased functionality and flexibility. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, the CC3200R1M1RGCR delivers exceptional value and benefits to help you bring your projects to life. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good durability and protection for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6V

Higher maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape provides uniformity and ease of placement in designs.

Bit Size: 32

32-bit architecture enables handling of complex calculations and data processing efficiently.

No. of Terminals: 64

Enough terminals for connectivity options and expansion capabilities in the product design.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer flexibility in design integration and thermal management.

Minimum Supply Voltage: 2.1V

Lower minimum supply voltage allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes the microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperatures enhances the versatility of the product.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures reliable connections and resistance to corrosion.

ADC Channels: YES

Built-in ADC channels enable analog signal processing without external components.

DMA Channels: YES

DMA channels improve data transfer efficiency and reduce CPU overhead.

Terminal Position: QUAD

Quad terminal position layout enhances the connectivity options and PCB routing flexibility.

ROM Words: 65536

Sufficient ROM capacity for storing program instructions and data.

Maximum Seated Height: 1mm

Low profile design saves space and allows for compact product configurations.

Width: 9mm

Compact width dimension enables integration in space-constrained designs.

Peripherals: DMA(32), POR, PWM, RTC, TIMER(4), WDT

Rich set of peripherals enhance the functionality and capabilities of the microcontroller.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and assembly processes.

Length: 9mm

Compact length dimension for fitting into tight spaces in product designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC microcontroller architecture provides efficient processing and low power consumption.

RAM Bytes: 131072

Generous RAM capacity for data storage and processing requirements of the application.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures long-term reliability.

Analog To Digital Convertors: 4-Ch 12-Bit

Multiple ADC channels with high resolution support analog signal processing and sensor interfacing.

Nominal Supply Voltage: 3.3V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

PWM Channels: YES

PWM channels enable precise control of connected devices and support for various applications.

Connectivity: I2C, I2S(2), SD, SPI, UART(2)

Versatile connectivity options for interfacing with external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and customization of firmware.

Terminal Pitch: 0.5mm

Fine terminal pitch enables high-density PCB layouts and miniaturization of products.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions.

Speed: 80rpm

Operating at 80 rotations per minute, the microcontroller supports real-time control applications.

On Chip Program ROM Width: 8

8-bit width of on-chip ROM program enables efficient storage and retrieval of instructions.

No. of I/O Lines: 27

Sufficient I/O lines for interfacing with external devices and sensors in the product design.

Technical Specifications

Microcontrollers CC3200R1M1RGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

HAVING 40MHZ CRYSTAL FREQUENCY WITH +/-20PPM ACCURACY.

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S(2), SD, SPI, UART(2)

Peripherals:

DMA(32), POR, PWM, RTC, TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 12-Bit

Trade Compliance

CC3200R1M1RGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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