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CC2630F128RSMT

Texas Instruments

CC2630F128RSMT by Texas Instruments

CC2630F128RSMT by Texas Instruments is a 16-bit microcontroller with 32 terminals, operating at temperatures from -40 to 85°C. It features ADC and DMA channels, PWM support, and ROM programmability for industrial applications requiring a compact chip carrier package with a low profile design.

Median Price

$5.369

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,450 parts In-Stock

1+ parts

$4.238

100+ parts

$3.455

1k+ parts

$2.303

10k+ parts

-

7,450

$4.238

$3.455

$2.303

-

DigiKey

USA . 104 parts In-Stock

1+ parts

$6.500

100+ parts

$4.912

1k+ parts

$4.390

10k+ parts

$4.197

104

$6.500

$4.912

$4.390

$4.197

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,940 parts In-Stock

1+ parts

$4.026

100+ parts

-

1k+ parts

-

10k+ parts

-

3,940

$4.026

-

-

-

Vyrian

USA . 5,304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,304

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 593 parts In-Stock

1+ parts

$0.045

100+ parts

-

1k+ parts

-

10k+ parts

$0.043

593

$0.045

-

-

$0.043

Corohmni

South Africa . 217 parts In-Stock

1+ parts

$3.685

100+ parts

-

1k+ parts

-

10k+ parts

-

217

$3.685

-

-

-

Corphita

USA . 372 parts In-Stock

1+ parts

$3.814

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$3.814

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$28.925

100+ parts

$26.322

1k+ parts

$23.718

10k+ parts

-

5,000

$28.925

$26.322

$23.718

-

Parana Technologies

USA . 477 parts In-Stock

1+ parts

$44.608

100+ parts

-

1k+ parts

-

10k+ parts

-

477

$44.608

-

-

-

DigiPath Technology Company

USA . 964 parts In-Stock

1+ parts

$49.119

100+ parts

-

1k+ parts

-

10k+ parts

-

964

$49.119

-

-

-

ChromeModa Solutions

Germany . 2,132 parts In-Stock

1+ parts

$50.121

100+ parts

$41.099

1k+ parts

-

10k+ parts

-

2,132

$50.121

$41.099

-

-

IDEA Electronic Components Group

UK . 881 parts In-Stock

1+ parts

$50.121

100+ parts

$47.615

1k+ parts

$45.109

10k+ parts

-

881

$50.121

$47.615

$45.109

-

A-Z Elektronik GmbH

Germany . 4,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,803

-

-

-

-

Alle Elektronik GmbH

Germany . 3,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,202

-

-

-

-

Northwest PG Solutions

USA . 593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

593

-

-

-

-

Overview

Unlock unparalleled performance and reliability with the CC2630F128RSMT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and cutting-edge technology in their microcontrollers. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. Experience seamless operation and enhanced functionality with the CC2630F128RSMT, setting new standards in the world of microcontrollers. Elevate your projects to new heights with this innovative and reliable solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan.

Surface Mount: YES

Allows for easier and more efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.8 V

Provides flexibility in power supply options without risking damage to the microcontroller.

Package Shape: SQUARE

Enables efficient use of space on the PCB, optimizing layout and design.

Bit Size: 16

Offers sufficient processing power for a variety of applications while maintaining a reasonable cost.

No. of Terminals: 32

Provides enough I/O options for connecting to external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances thermal performance and allows for compact and efficient design.

Minimum Supply Voltage: 1.8 V

Ensures compatibility with lower voltage systems, expanding the range of applications for the microcontroller.

Maximum Operating Temperature: 85 °C

Can withstand high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in cold environments, enhancing versatility of the microcontroller.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog input processing, enabling the microcontroller to interface with a variety of sensors.

DMA Channels: YES

Enables efficient data transfer between peripheral devices and memory, improving overall performance.

Terminal Position: QUAD

Facilitates easy PCB layout and routing of signals for streamlined design.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact product dimensions.

Width: 4 mm

Compact width allows for efficient use of PCB space and layout flexibility.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes for reliable assembly.

Length: 4 mm

Compact length contributes to overall space-saving design on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for harsh operating conditions, making it ideal for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing and optimized performance.

Technology: CMOS

Offers low power consumption and high noise immunity for energy-efficient operation.

Terminal Form: NO LEAD

Lead-free terminal form compliant with environmental regulations and industry standards.

Nominal Supply Voltage: 3.3 V

Standard supply voltage simplifies design and compatibility with existing systems.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware without requiring external programming hardware.

Terminal Pitch: 0.4 mm

Fine pitch terminals enable high-density routing for more complex designs.

Moisture Sensitivity Level (MSL): 3

Moderate MSL rating indicates robustness to moisture exposure during storage or assembly.

Speed: 48 rpm

Provides high processing speed for quick response times and efficient operation.

No. of I/O Lines: 10

Sufficient I/O lines for interfacing with external devices and peripherals, offering versatility in application design.

Technical Specifications

Microcontrollers CC2630F128RSMT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CC2630F128RSMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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