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CC2630F128RHBT

Texas Instruments

CC2630F128RHBT by Texas Instruments

Texas Instruments CC2630F128RHBT is a 16-bit microcontroller with 32 terminals, operating b/w -40 to 85°C. It features ADC and DMA channels, PWM support, and ROM programmability for industrial applications requiring CMOS technology in a compact chip carrier package.

Median Price

$2.316

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7 parts In-Stock

1+ parts

$0.569

100+ parts

-

1k+ parts

-

10k+ parts

-

7

$0.569

-

-

-

Texas Instruments

USA . 7,500 parts In-Stock

1+ parts

$4.054

100+ parts

$3.305

1k+ parts

$2.203

10k+ parts

-

7,500

$4.054

$3.305

$2.203

-

Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$8.390

100+ parts

$5.400

1k+ parts

$4.150

10k+ parts

-

245

$8.390

$5.400

$4.150

-

Chip1Stop

Japan . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.577

10k+ parts

-

7

-

-

$0.577

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,475 parts In-Stock

1+ parts

$0.548

100+ parts

-

1k+ parts

-

10k+ parts

-

2,475

$0.548

-

-

-

Vyrian

USA . 4,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,975

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 789 parts In-Stock

1+ parts

$0.519

100+ parts

-

1k+ parts

-

10k+ parts

-

789

$0.519

-

-

-

Parana Technologies

USA . 1,312 parts In-Stock

1+ parts

$17.675

100+ parts

-

1k+ parts

$17.864

10k+ parts

-

1,312

$17.675

-

$17.864

-

ChromeModa Solutions

Germany . 4,045 parts In-Stock

1+ parts

$19.860

100+ parts

$16.285

1k+ parts

-

10k+ parts

-

4,045

$19.860

$16.285

-

-

IDEA Electronic Components Group

UK . 956 parts In-Stock

1+ parts

$19.860

100+ parts

$18.867

1k+ parts

$17.874

10k+ parts

-

956

$19.860

$18.867

$17.874

-

Northwest PG Solutions

USA . 1,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.919

10k+ parts

-

1,439

-

-

$3.919

-

DigiPath Technology Company

USA . 1,337 parts In-Stock

1+ parts

-

100+ parts

$17.906

1k+ parts

-

10k+ parts

-

1,337

-

$17.906

-

-

Native Components

USA . 503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.879

10k+ parts

-

503

-

-

$3.879

-

Overview

Unlock the potential of your next project with the CC2630F128RHBT by Texas Instruments, a top-quality microcontroller designed to meet the demands of industrial applications. Texas Instruments is renowned for its innovative technology and reliable products, making this microcontroller a smart choice for any design. With its advanced features like ADC and DMA channels, as well as ROM programmability and PWM capabilities, this microcontroller offers unparalleled value and flexibility. Trust in Texas Instruments to deliver exceptional performance and reliability for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic body material provides durability and lightweight design for easy integration into various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 3.8 V

Higher maximum supply voltage allows for flexibility in power input options, accommodating various voltage levels.

Package Shape: SQUARE

Square package shape enables compact and space-saving placement on PCBs, ideal for designs with limited space.

Bit Size: 16

16-bit processing capabilities provide enhanced performance and processing speed for complex tasks and applications.

No. of Terminals: 32

32 terminals offer ample connectivity options for peripherals and external devices, making the microcontroller versatile in its applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles provide flexibility in heat dissipation and space constraints, catering to different design requirements.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for efficient power consumption and operation at lower power levels, suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions, increasing the product's durability.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold environments, making the microcontroller suitable for various applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold terminal finish provides corrosion resistance, ensuring long-term reliability and stability in operation.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities in data acquisition.

DMA Channels: YES

Direct memory access channels enhance data transfer efficiency, enabling high-speed data processing and communication within the system.

Technical Specifications

Microcontrollers CC2630F128RHBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

15

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

CC2630F128RHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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