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BUF602IDRG4

Texas Instruments

BUF602IDRG4 by Texas Instruments

BUF602IDRG4 by Texas Instruments is a video amplifier IC with 2 functions, in a small outline package measuring 3.9mm x 4.9mm. It features industrial temperature grade and bipolar technology, suitable for audio/video amplification applications requiring surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,308 parts In-Stock

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5,308

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Digiode

USA . 2,491 parts In-Stock

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2,491

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,284 parts In-Stock

1+ parts

$2.723

100+ parts

-

1k+ parts

$3.206

10k+ parts

-

1,284

$2.723

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$3.206

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DigiPath Technology Company

USA . 811 parts In-Stock

1+ parts

$2.998

100+ parts

-

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811

$2.998

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ChromeModa Solutions

Germany . 5,346 parts In-Stock

1+ parts

$3.059

100+ parts

$2.508

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-

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5,346

$3.059

$2.508

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IDEA Electronic Components Group

UK . 1,673 parts In-Stock

1+ parts

$3.059

100+ parts

-

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$2.753

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1,673

$3.059

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$2.753

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Native Components

USA . 924 parts In-Stock

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$9.165

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924

$9.165

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Northwest PG Solutions

USA . 640 parts In-Stock

1+ parts

$10.082

100+ parts

$9.074

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640

$10.082

$9.074

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AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$15.201

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514

$15.201

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One Stop Electronics

USA . 1,529 parts In-Stock

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$15.800

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1,529

$15.800

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QUARKTWIN TECHNOLOGY LTD

USA . 22,353 parts In-Stock

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22,353

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Microchip USA

USA . 5,617 parts In-Stock

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5,617

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Corphita

USA . 3,288 parts In-Stock

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3,288

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Overview

Unleash the power of high-quality audio and video amplification with the BUF602IDRG4 by Texas Instruments. Crafted with precision and expertise, this video amplifier offers unparalleled performance and reliability for a wide range of applications. From enhancing sound quality in home entertainment systems to optimizing video signals in professional AV setups, this versatile component delivers exceptional value and benefits to customers seeking top-of-the-line audio and video amplification solutions. Trust Texas Instruments to provide you with the cutting-edge technology you need to elevate your audiovisual experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components, making this product a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving valuable manufacturing time and cost.

No. of Functions: 2

With 2 functions integrated into one component, this amplifier offers versatility and efficiency in audio and video signal processing.

Package Shape: RECTANGULAR

The rectangular package shape helps in easy placement on circuit boards, optimizing space utilization and providing a neat layout for the overall system design.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video amplification, this product ensures high-quality and clear video signals, making it ideal for applications where visual clarity is essential.

No. of Terminals: 8

Having 8 terminals allows for multiple connection points, enabling versatile configuration options and compatibility with various circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in conserving space on the circuit board, ideal for compact electronic devices or systems where size is a critical factor.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, this amplifier can withstand harsh environmental conditions, ensuring consistent performance in demanding applications.

Technology: BIPOLAR

Utilizing bipolar technology offers enhanced signal processing capabilities and higher bandwidth, making this amplifier suitable for high-performance audio and video applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during assembly, reducing the risk of potential signal losses or disruptions, ensuring stable performance.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this amplifier allows for precise and efficient soldering on circuit boards, ensuring accurate connections and optimal signal transmission.

Technical Specifications

Audio & Video Amplifiers BUF602IDRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

BUF602IDRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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