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BUF602IDR

Texas Instruments

BUF602IDR by Texas Instruments

BUF602IDR by Texas Instruments is a dual-function video amplifier with 8 terminals in a small outline package. It features bipolar technology, industrial temperature grade, and gull wing terminal form. Ideal for audio/video applications requiring surface mount compatibility and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,254 parts In-Stock

1+ parts

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8,254

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Digiode

USA . 1,637 parts In-Stock

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1,637

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Chip Stock

USA . 485 parts In-Stock

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485

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,015 parts In-Stock

1+ parts

$0.522

100+ parts

-

1k+ parts

$1.635

10k+ parts

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2,015

$0.522

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$1.635

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DigiPath Technology Company

USA . 1,077 parts In-Stock

1+ parts

$0.575

100+ parts

$0.529

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-

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1,077

$0.575

$0.529

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ChromeModa Solutions

Germany . 4,793 parts In-Stock

1+ parts

$0.587

100+ parts

$0.481

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4,793

$0.587

$0.481

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IDEA Electronic Components Group

UK . 1,345 parts In-Stock

1+ parts

$0.587

100+ parts

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$0.528

10k+ parts

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1,345

$0.587

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$0.528

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$9.599

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276

$9.599

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One Stop Electronics

USA . 892 parts In-Stock

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$13.800

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892

$13.800

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QUARKTWIN TECHNOLOGY LTD

USA . 23,155 parts In-Stock

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23,155

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A-Z Elektronik GmbH

Germany . 6,881 parts In-Stock

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6,881

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Corphita

USA . 4,589 parts In-Stock

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4,589

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Alle Elektronik GmbH

Germany . 4,587 parts In-Stock

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4,587

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Northwest PG Solutions

USA . 617 parts In-Stock

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617

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Microchip USA

USA . 375 parts In-Stock

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375

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Native Components

USA . 140 parts In-Stock

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140

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Overview

Elevate your audio and video experience with the BUF602IDR by Texas Instruments. Crafted with precision and excellence, this video amplifier offers unparalleled quality and performance. Whether you're looking to enhance your home entertainment system or optimize your professional audio setup, this small outline package delivers exceptional results. Say goodbye to subpar sound and blurry visuals - upgrade to the BUF602IDR and immerse yourself in a world of crystal-clear audio and razor-sharp video. Elevate your viewing and listening experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and enhancing the overall design of the system.

No. of Functions: 2

Having multiple functions in one component increases efficiency and reduces the need for additional components, simplifying the overall system design.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, allowing for easier integration into existing systems and reducing overall footprint.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality and optimized performance for video signals.

No. of Terminals: 8

With more terminals, there are increased connectivity options and versatility in circuit connections for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and enables a more compact and efficient design.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product can operate reliably in a wide range of temperature conditions, making it suitable for industrial applications.

Technology: BIPOLAR

The bipolar technology used in this product offers high performance and efficiency in amplifying the video signals, ensuring superior output quality.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections on the circuit board, preventing accidental disconnections and ensuring stable performance.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high density mounting on the circuit board, enabling more components to be placed in a limited space for enhanced functionality.

Technical Specifications

Audio & Video Amplifiers BUF602IDR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

BUF602IDR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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