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BUF601AU-TR

Texas Instruments

BUF601AU-TR by Texas Instruments

BUF601AU-TR by Texas Instruments is an 8-terminal video amplifier in a small outline package. With a width of 3.9mm and length of 4.9mm, it's ideal for industrial applications requiring bipolar technology. This surface-mount device with gull wing terminals is designed for audio and video amplification tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,027 parts In-Stock

1+ parts

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5,027

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Digiode

USA . 1,231 parts In-Stock

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1,231

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 991 parts In-Stock

1+ parts

$2.110

100+ parts

-

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991

$2.110

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Parana Technologies

USA . 1,860 parts In-Stock

1+ parts

$2.173

100+ parts

-

1k+ parts

$2.686

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1,860

$2.173

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$2.686

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Northwest PG Solutions

USA . 625 parts In-Stock

1+ parts

$2.321

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-

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625

$2.321

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ChromeModa Solutions

Germany . 6,611 parts In-Stock

1+ parts

$2.442

100+ parts

$2.002

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6,611

$2.442

$2.002

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$2.442

100+ parts

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$2.198

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1,406

$2.442

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$2.198

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One Stop Electronics

USA . 2,581 parts In-Stock

1+ parts

$8.800

100+ parts

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2,581

$8.800

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$17.727

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597

$17.727

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Corphita

USA . 2,882 parts In-Stock

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2,882

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DigiPath Technology Company

USA . 697 parts In-Stock

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$2.202

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697

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$2.202

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Overview

Enhance your audio and video experience with the BUF601AU-TR by Texas Instruments. Trusted for its superior quality, this video amplifier offers unmatched performance in a compact package. Ideal for a wide range of applications, from home entertainment systems to professional audio setups, this product delivers crystal-clear sound and sharp visuals. Elevate your viewing and listening experience with the BUF601AU-TR and enjoy top-notch quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and provide good protection for the internal components of the amplifier.

Surface Mount: YES

Surface mount capability allows for easy installation and integration on printed circuit boards.

Package Shape: RECTANGULAR

Rectangular shape helps in easy placement and alignment during assembly.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality video output.

No. of Terminals: 8

Sufficient number of terminals for connecting various input and output devices.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for compact designs.

Maximum Seated Height: 1.75 mm

Low profile height makes it suitable for applications with limited vertical space.

Width: 3.9 mm

Narrow width allows for efficient use of board space and compact installations.

Length: 4.9 mm

Short length helps in reducing overall footprint and simplifies layout design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency in signal amplification.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and easy soldering during assembly.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for convenient connections and compatibility with standard PCB layouts.

Technical Specifications

Audio & Video Amplifiers BUF601AU-TR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

BUF601AU-TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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