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BUF601AU/2K5

Texas Instruments

BUF601AU/2K5 by Texas Instruments

BUF601AU/2K5 by Texas Instruments is an 8-terminal video amplifier in a small outline package. With a width of 3.9mm and length of 4.9mm, it's ideal for industrial applications requiring bipolar technology and gull wing terminals for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,759 parts In-Stock

1+ parts

-

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4,759

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Vyrian

USA . 2,914 parts In-Stock

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2,914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 2,368 parts In-Stock

1+ parts

$1.410

100+ parts

-

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2,368

$1.410

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Parana Technologies

USA . 1,624 parts In-Stock

1+ parts

$3.091

100+ parts

-

1k+ parts

$3.609

10k+ parts

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1,624

$3.091

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$3.609

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DigiPath Technology Company

USA . 1,349 parts In-Stock

1+ parts

$3.404

100+ parts

-

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1,349

$3.404

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ChromeModa Solutions

Germany . 5,076 parts In-Stock

1+ parts

$3.473

100+ parts

$2.848

1k+ parts

-

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5,076

$3.473

$2.848

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IDEA Electronic Components Group

UK . 1,273 parts In-Stock

1+ parts

$3.473

100+ parts

-

1k+ parts

$3.126

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1,273

$3.473

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$3.126

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AZTECH Wire

Italy . 865 parts In-Stock

1+ parts

$8.400

100+ parts

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865

$8.400

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Corphita

USA . 1,767 parts In-Stock

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1,767

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Northwest PG Solutions

USA . 1,272 parts In-Stock

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1,272

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Native Components

USA . 412 parts In-Stock

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412

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Overview

Upgrade your audio and video experience with the BUF601AU/2K5 by Texas Instruments. This high-quality video amplifier offers crystal-clear sound and sharp images for all your entertainment needs. Manufactured by a trusted name in the industry, this product guarantees reliability and superior performance. Perfect for a wide range of applications, this amplifier is a must-have for anyone looking to enhance their audio and video setup. Don't settle for mediocre quality - invest in the BUF601AU/2K5 and take your entertainment to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat, making this amplifier suitable for industrial applications where reliability is key.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and making the assembly process more efficient.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, ideal for space-constrained designs without compromising on performance.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video applications, ensuring optimal performance and clarity in video signal amplification.

No. of Terminals: 8

Sufficient number of terminals for connectivity options, allowing for versatile use in various audio and video amplifier setups.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board and provides a sleek and modern look to the amplifier.

Maximum Seated Height: 1.75 mm

Low seated height enables the amplifier to be installed in compact electronic devices or systems with limited vertical space available.

Width: 3.9 mm

Narrow width allows for easy integration into tight spaces or alongside other components on a circuit board.

Length: 4.9 mm

Short length contributes to the overall compactness of the amplifier, making it an attractive choice for small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance across a wide range of operating temperatures, suitable for harsh industrial environments.

Technology: BIPOLAR

Bipolar technology provides high-quality amplification and signal processing capabilities, making this amplifier suitable for professional audio and video applications.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and reliability, ensuring a secure connection between the amplifier and the circuit board.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for high-density mounting on a PCB, enabling more compact and space-efficient designs for audio and video amplifier circuits.

Technical Specifications

Audio & Video Amplifiers BUF601AU/2K5 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

BUF601AU/2K5 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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