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BQ78PL114RGZR-12S

Texas Instruments

BQ78PL114RGZR-12S by Texas Instruments

BQ78PL114RGZR-12S by Texas Instruments is a Power Management IC with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.3V to 4.5V and features adjustable threshold levels for industrial applications requiring precise power supply management in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,193 parts In-Stock

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Digiode

USA . 2,892 parts In-Stock

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Semicontronic

India . 1,499 parts In-Stock

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$4.500

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$4.388

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$4.365

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1,499

$4.500

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$4.365

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One Stop Electronics

USA . 1,082 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 241 parts In-Stock

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$19.174

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Parana Technologies

USA . 1,781 parts In-Stock

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$20.571

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$20.662

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ChromeModa Solutions

Germany . 3,655 parts In-Stock

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$23.113

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$18.953

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$23.113

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IDEA Electronic Components Group

UK . 820 parts In-Stock

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$23.113

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$21.957

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$20.802

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Native Components

USA . 664 parts In-Stock

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$26.472

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Northwest PG Solutions

USA . 470 parts In-Stock

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$29.120

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$26.208

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Corphita

USA . 4,039 parts In-Stock

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Corohmni

South Africa . 431 parts In-Stock

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DigiPath Technology Company

USA . 167 parts In-Stock

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$20.839

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Overview

Elevate your power management capabilities with the BQ78PL114RGZR-12S by Texas Instruments, a leading manufacturer known for its high-quality products. Ideal for a wide range of applications, this Power Management IC offers unparalleled reliability and efficiency. With a package body material of PLASTIC/EPOXY and a terminal position of QUAD, this chip carrier ensures optimal performance in industrial settings. Experience the benefits of adjustable thresholds, no lead terminal forms, and a very thin profile package style that sets this product apart from the rest. Upgrade your power supply management circuit with the BQ78PL114RGZR-12S for seamless integration and superior functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and cost in production.

Nominal Supply Voltage (Vsup): 2.7 V

The nominal supply voltage of 2.7V is suitable for a wide range of applications, providing flexibility in power management.

No. of Terminals: 48

Having a high number of terminals allows for greater connectivity and functionality in the power management system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the product can function reliably even in extreme cold environments.

No. of Channels: 4

Having four channels allows for multiple power management functions to be controlled simultaneously, enhancing efficiency.

Technical Specifications

Power Management ICs BQ78PL114RGZR-12S attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

Length:

7 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

7 mm

Trade Compliance

BQ78PL114RGZR-12S Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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