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BQ78PL116RGZT

Texas Instruments

BQ78PL116RGZT by Texas Instruments

BQ78PL116RGZT by Texas Instruments is a Power Management IC with 48 terminals, operating at -40 to 85°C. It features a nominal voltage of 3.6V, suitable for industrial applications requiring power supply management circuits in compact spaces. The chip carrier package style with a very thin profile and nickel palladium gold finish makes it ideal for surface mount assembly.

Median Price

$27.950

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

$27.800

100+ parts

$17.700

1k+ parts

$13.700

10k+ parts

-

250

$27.800

$17.700

$13.700

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DigiKey

USA . 577 parts In-Stock

1+ parts

$27.950

100+ parts

$19.712

1k+ parts

$18.578

10k+ parts

-

577

$27.950

$19.712

$18.578

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Mouser Electronics

USA . 465 parts In-Stock

1+ parts

$27.950

100+ parts

$19.720

1k+ parts

$18.440

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465

$27.950

$19.720

$18.440

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Distributors (In-Stock)

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Digiode

USA . 455 parts In-Stock

1+ parts

$15.684

100+ parts

-

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455

$15.684

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Nova Conductors

Japan . 30 parts In-Stock

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$17.480

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30

$17.480

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Chip Stock

USA . 4,680 parts In-Stock

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4,680

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VNN

France . 915 parts In-Stock

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Vyrian

USA . 586 parts In-Stock

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PC Components Company LLC

USA . 180 parts In-Stock

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180

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Bristol Electronics

USA . 130 parts In-Stock

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130

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Distributors (Availability)

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Corohmni

South Africa . 838 parts In-Stock

1+ parts

$8.809

100+ parts

-

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838

$8.809

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Parana Technologies

USA . 790 parts In-Stock

1+ parts

$8.961

100+ parts

-

1k+ parts

$9.630

10k+ parts

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790

$8.961

-

$9.630

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DigiPath Technology Company

USA . 2,239 parts In-Stock

1+ parts

$9.867

100+ parts

$9.077

1k+ parts

-

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2,239

$9.867

$9.077

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ChromeModa Solutions

Germany . 4,916 parts In-Stock

1+ parts

$10.068

100+ parts

$8.256

1k+ parts

-

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4,916

$10.068

$8.256

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IDEA Electronic Components Group

UK . 1,848 parts In-Stock

1+ parts

$10.068

100+ parts

$9.565

1k+ parts

$9.061

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1,848

$10.068

$9.565

$9.061

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Ampacity Inc.

Singapore . 201 parts In-Stock

1+ parts

$14.030

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201

$14.030

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Corphita

USA . 4,796 parts In-Stock

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$14.859

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4,796

$14.859

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Continental Prestige Electronics

USA . 6,510 parts In-Stock

1+ parts

$17.480

100+ parts

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$17.130

6,510

$17.480

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-

$17.130

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$17.830

100+ parts

$17.830

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$17.830

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500

$17.830

$17.830

$17.830

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Semicontronic

India . 430 parts In-Stock

1+ parts

$30.540

100+ parts

$29.776

1k+ parts

$29.624

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430

$30.540

$29.776

$29.624

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Microchip USA

USA . 1,293 parts In-Stock

1+ parts

$49.410

100+ parts

$48.710

1k+ parts

$48.350

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$48.000

1,293

$49.410

$48.710

$48.350

$48.000

Lixinc

USA . 9,970 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,957 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,638 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Argo Parts USA

USA . 3,709 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$17.130

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$16.606

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$16.256

2,000

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$17.130

$16.606

$16.256

Kepictronics

USA . 531 parts In-Stock

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531

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Overview

Discover the cutting-edge BQ78PL116RGZT by Texas Instruments, a top-tier Power Management IC that embodies quality and innovation. With a focus on precision engineering and reliability, Texas Instruments has created a product that exceeds industry standards. From industrial automation to automotive applications, this versatile chip is designed to optimize power efficiency while providing seamless performance. Elevate your projects with the value, benefits, and advantages of the BQ78PL116RGZT, setting new benchmarks in power supply management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product is lightweight yet sturdy, making it ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape maximizes space efficiency on the PCB, enabling a compact design for the overall system.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6V supply voltage is in the optimal range for a wide range of devices, providing stable power to ensure reliable performance.

No. of Terminals: 48

With 48 terminals, this product offers versatile connectivity options for various input and output configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This unique package style combination provides efficient heat dissipation and space-saving benefits for improved overall performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can function in extreme cold environments without any performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and durability, ensuring long-term reliability in various applications.

Terminal Position: QUAD

The quad terminal position provides a convenient layout for easy connection and compatibility with standard circuit board layouts.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a slim and compact design, making it suitable for space-constrained applications.

Width (mm): 7 mm

The 7mm width provides a balance between compact size and ease of handling during installation and maintenance.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, this product offers efficient power distribution and control, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V allows for flexibility in power input options, accommodating a wider range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures quick and efficient soldering during assembly, reducing production time.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C supports high-temperature soldering processes, ensuring secure and reliable connections.

Length: 7 mm

With a length of 7mm, this product has a balanced form factor that fits well in various electronic devices.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding industrial environments with fluctuating temperatures.

No. of Channels: 2

With 2 channels, this product offers dual power management capabilities for increased efficiency and flexibility in power distribution.

Terminal Form: NO LEAD

The no-lead terminal form minimizes the risk of lead contamination and offers environmental benefits during disposal.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm provides precise and secure connections on the circuit board, reducing the risk of connectivity issues.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates moderate moisture sensitivity, making this product suitable for a wide range of environments with varying humidity levels.

Maximum Supply Voltage (Vsup): 4.5 V

The maximum supply voltage of 4.5V offers compatibility with a wide range of power sources, ensuring versatility in application compatibility.

Adjustable Threshold: YES

The adjustable threshold feature allows for customizable power management settings, enabling fine-tuning for specific performance requirements.

Technical Specifications

Power Management ICs BQ78PL116RGZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

BQ78PL116RGZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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