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BQ78PL116RGZR

Texas Instruments

BQ78PL116RGZR by Texas Instruments

BQ78PL116RGZR by Texas Instruments is a Power Management IC with 48 terminals, operating b/w -40 to 85°C. It features a nominal voltage of 3.6V and is suitable for industrial applications requiring power supply management circuits in compact spaces due to its small form factor and surface-mount capability.

Median Price

$15.770

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,318 parts In-Stock

1+ parts

$17.040

100+ parts

$14.884

1k+ parts

$10.265

10k+ parts

-

12,318

$17.040

$14.884

$10.265

-

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$14.500

1k+ parts

$12.970

10k+ parts

$12.210

6

-

$14.500

$12.970

$12.210

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$10.265

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$10.265

-

-

-

Digiode

USA . 279 parts In-Stock

1+ parts

$13.547

100+ parts

-

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279

$13.547

-

-

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Vyrian

USA . 7,955 parts In-Stock

1+ parts

-

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-

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7,955

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-

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Chip Stock

USA . 4,590 parts In-Stock

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-

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4,590

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VNN

France . 797 parts In-Stock

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797

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,192 parts In-Stock

1+ parts

$7.951

100+ parts

-

1k+ parts

$8.520

10k+ parts

-

2,192

$7.951

-

$8.520

-

DigiPath Technology Company

USA . 670 parts In-Stock

1+ parts

$8.755

100+ parts

$8.055

1k+ parts

-

10k+ parts

-

670

$8.755

$8.055

-

-

ChromeModa Solutions

Germany . 5,912 parts In-Stock

1+ parts

$8.934

100+ parts

$7.326

1k+ parts

-

10k+ parts

-

5,912

$8.934

$7.326

-

-

IDEA Electronic Components Group

UK . 801 parts In-Stock

1+ parts

$8.934

100+ parts

$8.487

1k+ parts

$8.041

10k+ parts

-

801

$8.934

$8.487

$8.041

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Continental Prestige Electronics

USA . 5,951 parts In-Stock

1+ parts

$10.265

100+ parts

-

1k+ parts

-

10k+ parts

$10.060

5,951

$10.265

-

-

$10.060

Corphita

USA . 2,004 parts In-Stock

1+ parts

$12.834

100+ parts

-

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2,004

$12.834

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AZTECH Wire

Italy . 157 parts In-Stock

1+ parts

$21.370

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157

$21.370

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Ampacity Inc.

Singapore . 5,964 parts In-Stock

1+ parts

$26.380

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5,964

$26.380

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Authorized Procurement Solutions

USA . 38,400 parts In-Stock

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38,400

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A-Z Elektronik GmbH

Germany . 7,670 parts In-Stock

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7,670

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 1,379 parts In-Stock

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1,379

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Alle Elektronik GmbH

Germany . 1,180 parts In-Stock

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1,180

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-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$10.060

1k+ parts

$9.752

10k+ parts

$9.546

1,000

-

$10.060

$9.752

$9.546

Overview

Experience unmatched reliability and efficiency with the BQ78PL116RGZR by Texas Instruments, a leading manufacturer in the Power Management ICs category. This high-quality product offers a wide range of applications and benefits, from its durable plastic/epoxy package body material to its innovative chip carrier design. With a nominal supply voltage of 3.6V and adjustable threshold feature, this IC is perfect for industrial use. Trust Texas Instruments to deliver top-notch performance and value with the BQ78PL116RGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy assembly and space-saving on PCBs, making it suitable for compact designs.

Package Shape: SQUARE

Square package shape enables efficient use of board space and facilitates uniform heat dissipation for improved device reliability.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6V supply voltage provides a stable power source for optimized performance and energy efficiency.

No. of Terminals: 48

With 48 terminals, this product offers versatile connectivity options, making it compatible with a wide range of applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with heat sink/slug and very thin profile design enhances thermal management and minimizes space constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C guarantees consistent performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers increased stability and robustness, making it suitable for high-performance applications.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for compact device designs and efficient heat dissipation.

Width (mm): 7 mm

The 7mm width ensures compatibility with standard PCB layouts and allows for easy integration into existing systems.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This product features a power supply management circuit, providing efficient power distribution and protection for connected devices.

Minimum Supply Voltage (Vsup): 2.5 V

The 2.5V minimum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility in system design.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature streamlines the manufacturing process, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and optimal performance during assembly.

Length: 7 mm

The 7mm length provides a compact form factor, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature environments.

No. of Channels: 2

With 2 channels, this product offers dual power management capabilities, providing efficient control and distribution of power.

Terminal Form: NO LEAD

The no lead terminal form complies with environmental regulations and promotes sustainability in manufacturing processes.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise connections and reduces the risk of short circuits, ensuring reliable operation.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of protection against moisture ingress, making it suitable for a variety of operating environments.

Maximum Supply Voltage (Vsup): 4.5 V

The 4.5V maximum supply voltage provides enough headroom for power fluctuations, ensuring stable operation under varying conditions.

Adjustable Threshold: YES

The adjustable threshold feature allows for customizable power management settings, catering to specific power requirements and applications.

Technical Specifications

Power Management ICs BQ78PL116RGZR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

BQ78PL116RGZR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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