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BQ771803DPJT

Texas Instruments

BQ771803DPJT by Texas Instruments

BQ771803DPJT by Texas Instruments is a Power Management IC with 8 terminals, operating temperature range of -40 to 110°C, and supply voltage up to 25V. It is designed for power supply support circuits in industrial applications, featuring a small outline package with very thin profile and nickel palladium gold terminal finish.

Median Price

$1.046

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 750 parts In-Stock

1+ parts

$0.736

100+ parts

$0.692

1k+ parts

$0.626

10k+ parts

-

750

$0.736

$0.692

$0.626

-

Texas Instruments

USA . 2,500 parts In-Stock

1+ parts

$1.309

100+ parts

$1.007

1k+ parts

$0.530

10k+ parts

-

2,500

$1.309

$1.007

$0.530

-

DigiKey

USA . 458 parts In-Stock

1+ parts

$1.540

100+ parts

$0.907

1k+ parts

$0.803

10k+ parts

$0.763

458

$1.540

$0.907

$0.803

$0.763

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.782

10k+ parts

-

750

-

-

$0.782

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,562 parts In-Stock

1+ parts

$0.699

100+ parts

-

1k+ parts

-

10k+ parts

-

4,562

$0.699

-

-

-

Vyrian

USA . 6,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,056

-

-

-

-

DigiKey Marketplace

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$0.770

1k+ parts

-

10k+ parts

-

750

-

$0.770

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,353 parts In-Stock

1+ parts

$0.662

100+ parts

-

1k+ parts

-

10k+ parts

-

2,353

$0.662

-

-

-

Parana Technologies

USA . 262 parts In-Stock

1+ parts

$7.619

100+ parts

-

1k+ parts

$8.137

10k+ parts

-

262

$7.619

-

$8.137

-

DigiPath Technology Company

USA . 105 parts In-Stock

1+ parts

$8.390

100+ parts

-

1k+ parts

-

10k+ parts

-

105

$8.390

-

-

-

Native Components

USA . 468 parts In-Stock

1+ parts

$8.440

100+ parts

-

1k+ parts

-

10k+ parts

-

468

$8.440

-

-

-

ChromeModa Solutions

Germany . 4,891 parts In-Stock

1+ parts

$8.561

100+ parts

$7.020

1k+ parts

-

10k+ parts

-

4,891

$8.561

$7.020

-

-

IDEA Electronic Components Group

UK . 1,040 parts In-Stock

1+ parts

$8.561

100+ parts

$8.133

1k+ parts

$7.705

10k+ parts

-

1,040

$8.561

$8.133

$7.705

-

Northwest PG Solutions

USA . 1,963 parts In-Stock

1+ parts

$9.284

100+ parts

$8.356

1k+ parts

-

10k+ parts

-

1,963

$9.284

$8.356

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$22.138

100+ parts

$20.146

1k+ parts

$18.153

10k+ parts

-

500

$22.138

$20.146

$18.153

-

Lixinc

USA . 12,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,463

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Unlock the power of efficient power management with the BQ771803DPJT by Texas Instruments. Designed with precision and durability in mind, this Power Management IC offers unparalleled reliability and performance. Whether you're looking to optimize battery life in portable devices or enhance power efficiency in industrial applications, this product delivers unmatched value and benefits. Experience seamless integration, high-quality construction, and exceptional functionality with Texas Instruments' cutting-edge technology. Elevate your projects with the BQ771803DPJT and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and simplifies the design and layout of the circuit board.

Power Supplies (V): 3/25

The wide range of power supply options (3-25V) makes this product versatile and suitable for a variety of applications.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options and flexibility in circuit configurations.

Maximum Operating Temperature: 110 °C

With a high maximum operating temperature of 110°C, the product can withstand elevated operating conditions.

Minimum Operating Temperature: -40 °C

The product's low minimum operating temperature of -40°C ensures reliable performance in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances conductivity and ensures long-term reliability of the product.

Width (mm): 3 mm

The compact width of 3mm makes this product suitable for space-constrained applications.

Maximum Supply Voltage (Vsup): 25 V

The high maximum supply voltage of 25V allows for compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs BQ771803DPJT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3.85 and 4.65

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/25

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.275V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ771803DPJT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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