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BQ40Z50RSMT

Texas Instruments

BQ40Z50RSMT by Texas Instruments

BQ40Z50RSMT by Texas Instruments is a Power Management IC with 32 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.2V to 26V and features an adjustable threshold for industrial applications requiring precise power supply management in compact spaces.

Median Price

$7.440

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 372 parts In-Stock

1+ parts

$7.440

100+ parts

$4.856

1k+ parts

$4.434

10k+ parts

$4.317

372

$7.440

$4.856

$4.434

$4.317

Mouser Electronics

USA . 255 parts In-Stock

1+ parts

$7.440

100+ parts

$4.770

1k+ parts

$3.520

10k+ parts

-

255

$7.440

$4.770

$3.520

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Texas Instruments

USA . 41,403 parts In-Stock

1+ parts

$9.777

100+ parts

$8.567

1k+ parts

$4.840

10k+ parts

-

41,403

$9.777

$8.567

$4.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$7.470

100+ parts

-

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52

$7.470

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-

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Digiode

USA . 131 parts In-Stock

1+ parts

$9.288

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-

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131

$9.288

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Chip Stock

USA . 118,120 parts In-Stock

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118,120

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Vyrian

USA . 6,679 parts In-Stock

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6,679

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VNN

France . 60 parts In-Stock

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60

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Distributors (Availability)

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Semicontronic

India . 13,430 parts In-Stock

1+ parts

$7.100

100+ parts

$6.922

1k+ parts

$6.887

10k+ parts

-

13,430

$7.100

$6.922

$6.887

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Continental Prestige Electronics

USA . 4,224 parts In-Stock

1+ parts

$7.470

100+ parts

-

1k+ parts

-

10k+ parts

$7.321

4,224

$7.470

-

-

$7.321

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$7.470

100+ parts

$7.096

1k+ parts

-

10k+ parts

$6.648

300

$7.470

$7.096

-

$6.648

Corphita

USA . 2,111 parts In-Stock

1+ parts

$8.799

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-

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2,111

$8.799

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Parana Technologies

USA . 211 parts In-Stock

1+ parts

$9.610

100+ parts

-

1k+ parts

$10.205

10k+ parts

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211

$9.610

-

$10.205

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ChromeModa Solutions

Germany . 3,800 parts In-Stock

1+ parts

$10.798

100+ parts

$8.854

1k+ parts

-

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3,800

$10.798

$8.854

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IDEA Electronic Components Group

UK . 983 parts In-Stock

1+ parts

$10.798

100+ parts

$10.258

1k+ parts

$9.718

10k+ parts

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983

$10.798

$10.258

$9.718

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Ampacity Inc.

Singapore . 13,883 parts In-Stock

1+ parts

$15.450

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13,883

$15.450

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Corohmni

South Africa . 1 parts In-Stock

1+ parts

$23.098

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1

$23.098

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Microchip USA

USA . 2,992 parts In-Stock

1+ parts

$23.290

100+ parts

$22.960

1k+ parts

$22.790

10k+ parts

$22.630

2,992

$23.290

$22.960

$22.790

$22.630

Lixinc

USA . 19,175 parts In-Stock

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Argo Parts USA

USA . 4,300 parts In-Stock

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4,300

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DigiPath Technology Company

USA . 2,283 parts In-Stock

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$9.735

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2,283

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$9.735

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Perfect Parts

USA . 124 parts In-Stock

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124

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Overview

Discover the power of the BQ40Z50RSMT by Texas Instruments, a top-quality Power Management IC that offers unparalleled reliability and performance. With a wide range of applications in various industries, this innovative product is designed to provide customers with maximum value and benefits. Trust in Texas Instruments' reputation for excellence and choose the BQ40Z50RSMT for all your power management needs. Experience the advantages of superior quality and efficiency with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, this product allows for easy installation and saves space on PCBs.

Package Shape: SQUARE

The square package shape offers uniform heat dissipation and efficient PCB layout.

Nominal Supply Voltage (Vsup): 14.4 V

The 14.4V supply voltage ensures reliable power management in various applications.

No. of Terminals: 32

With 32 terminals, this product provides ample connectivity options for complex power systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles enables efficient thermal management and space-saving design.

Maximum Operating Temperature: 85 °C

With an operating temperature of 85°C, this product is suitable for industrial environments with high temperature requirements.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature ensures reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finish on terminals provides excellent corrosion resistance and conductivity.

Terminal Position: QUAD

The quad terminal position offers increased stability and robustness in the product's connections.

Maximum Seated Height: 1 mm

The low seated height of 1mm allows for compact design and efficient space utilization on PCBs.

Width (mm): 4 mm

The 4mm width ensures compatibility with standard PCB layouts and facilitates easy integration.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This product's power supply management circuit type ensures efficient and reliable power delivery to connected devices.

Minimum Supply Voltage (Vsup): 2.2 V

The 2.2V minimum supply voltage allows for operation in low power scenarios without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures safe and consistent soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without damage.

Length: 4 mm

The 4mm length of this product offers a compact form factor, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions.

Terminal Form: NO LEAD

The no lead terminal form complies with RoHS regulations and offers environmental sustainability.

Terminal Pitch: 0.4 mm

The 0.4mm terminal pitch allows for precise alignment and reduced signal interference in high-density PCB layouts.

Moisture Sensitivity Level (MSL): 2

With MSL 2, this product can withstand moderate moisture exposure during storage and handling.

Maximum Supply Voltage (Vsup): 26 V

The 26V maximum supply voltage provides flexibility in power input options for diverse applications.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of voltage levels, making this product versatile for various power management needs.

Technical Specifications

Power Management ICs BQ40Z50RSMT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

14.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ40Z50RSMT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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