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BQ40Z60RHBR

Texas Instruments

BQ40Z60RHBR by Texas Instruments

BQ40Z60RHBR by Texas Instruments is a Power Management IC with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.2V to 26V and adjustable threshold feature. Suitable for industrial applications, it comes in a square chip carrier package with very thin profile.

Median Price

$11.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,268 parts In-Stock

1+ parts

$11.630

100+ parts

$10.159

1k+ parts

$7.006

10k+ parts

-

22,268

$11.630

$10.159

$7.006

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,808 parts In-Stock

1+ parts

$11.048

100+ parts

-

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-

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2,808

$11.048

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-

-

Chip Stock

USA . 16,500 parts In-Stock

1+ parts

-

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16,500

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Vyrian

USA . 6,648 parts In-Stock

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6,648

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Semtec, LLC

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,183 parts In-Stock

1+ parts

$9.483

100+ parts

$880.636

1k+ parts

$8.535

10k+ parts

-

2,183

$9.483

$880.636

$8.535

-

DigiPath Technology Company

USA . 860 parts In-Stock

1+ parts

$10.442

100+ parts

$9.607

1k+ parts

-

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-

860

$10.442

$9.607

-

-

Corphita

USA . 4,011 parts In-Stock

1+ parts

$10.467

100+ parts

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4,011

$10.467

-

-

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ChromeModa Solutions

Germany . 5,721 parts In-Stock

1+ parts

$10.655

100+ parts

$8.737

1k+ parts

-

10k+ parts

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5,721

$10.655

$8.737

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IDEA Electronic Components Group

UK . 184 parts In-Stock

1+ parts

$10.655

100+ parts

$10.122

1k+ parts

$9.590

10k+ parts

-

184

$10.655

$10.122

$9.590

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$15.360

100+ parts

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246

$15.360

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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30,000

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Lixinc

USA . 9,866 parts In-Stock

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9,866

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Northwest PG Solutions

USA . 2,177 parts In-Stock

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2,177

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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1,500

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Native Components

USA . 688 parts In-Stock

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688

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A-Z Elektronik GmbH

Germany . 111 parts In-Stock

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111

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Overview

Enhance your power management capabilities with the BQ40Z60RHBR by Texas Instruments. Crafted with precision and reliability, this Power Management IC offers unparalleled performance in a compact package. Ideal for industrial applications, this innovative product boasts a wide supply voltage range and adjustable threshold for optimal efficiency. Trust Texas Instruments to deliver cutting-edge solutions that elevate your projects to new heights of success. Experience the difference with the BQ40Z60RHBR - where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the package, making it suitable for various industrial applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 10.8V

The nominal supply voltage of 10.8V provides a stable power source for the connected devices, ensuring consistent performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the power management IC to function reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the power management IC can operate efficiently in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, enhancing the overall performance and lifespan of the product.

Width (mm): 5mm

The compact width of 5mm allows for space-efficient installation in tight PCB layouts, enabling versatile application possibilities.

Minimum Supply Voltage (Vsup): 2.2V

The minimum supply voltage of 2.2V ensures compatibility with a wide range of power sources, making the power management IC versatile and adaptable.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for reliable soldering during the assembly process, ensuring a secure connection between the IC and the PCB.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper solder melting and joint formation, resulting in a durable and stable connection.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the power management IC can withstand harsh operating conditions in industrial environments, making it a reliable choice for various applications.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that the power management IC is resistant to moisture, preventing corrosion and ensuring long-term reliability.

Technical Specifications

Power Management ICs BQ40Z60RHBR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

10.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

BQ40Z60RHBR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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