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BQ40Z80RSMR

Texas Instruments

BQ40Z80RSMR by Texas Instruments

BQ40Z80RSMR by Texas Instruments is a Power Management IC with 32 terminals, operating temperature range of -40 to 85°C, and supply voltage from 2.2V to 32V. It is ideal for industrial applications requiring power supply management circuits in compact spaces due to its small form factor and adjustable threshold feature.

Median Price

$4.761

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,837 parts In-Stock

1+ parts

$3.792

100+ parts

$3.322

1k+ parts

$1.877

10k+ parts

-

16,837

$3.792

$3.322

$1.877

-

DigiKey

USA . 6,618 parts In-Stock

1+ parts

$5.730

100+ parts

$3.678

1k+ parts

$3.309

10k+ parts

$3.201

6,618

$5.730

$3.678

$3.309

$3.201

Mouser Electronics

USA . 1,870 parts In-Stock

1+ parts

$5.730

100+ parts

$3.680

1k+ parts

$3.310

10k+ parts

$3.200

1,870

$5.730

$3.680

$3.310

$3.200

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.287

3,000

-

-

-

$2.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$2.670

100+ parts

-

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32

$2.670

-

-

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Digiode

USA . 593 parts In-Stock

1+ parts

$3.602

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-

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593

$3.602

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Chip Stock

USA . 36,200 parts In-Stock

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36,200

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Vyrian

USA . 6,209 parts In-Stock

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VNN

France . 849 parts In-Stock

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849

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,212 parts In-Stock

1+ parts

$1.940

100+ parts

$1.892

1k+ parts

$1.882

10k+ parts

-

6,212

$1.940

$1.892

$1.882

-

Continental Prestige Electronics

USA . 5,489 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

$2.617

5,489

$2.670

-

-

$2.617

Argo Parts USA

USA . 2,494 parts In-Stock

1+ parts

$2.670

100+ parts

-

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2,494

$2.670

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

$2.537

10k+ parts

$2.483

100

$2.670

-

$2.537

$2.483

Corphita

USA . 4,351 parts In-Stock

1+ parts

$3.413

100+ parts

-

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4,351

$3.413

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Ampacity Inc.

Singapore . 6,050 parts In-Stock

1+ parts

$4.230

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$4.230

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$14.680

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191

$14.680

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Parana Technologies

USA . 2,357 parts In-Stock

1+ parts

$16.688

100+ parts

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$16.951

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2,357

$16.688

-

$16.951

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DigiPath Technology Company

USA . 568 parts In-Stock

1+ parts

$18.376

100+ parts

$16.906

1k+ parts

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568

$18.376

$16.906

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-

IDEA Electronic Components Group

UK . 2,044 parts In-Stock

1+ parts

$18.751

100+ parts

$17.813

1k+ parts

$16.876

10k+ parts

-

2,044

$18.751

$17.813

$16.876

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ChromeModa Solutions

Germany . 1,016 parts In-Stock

1+ parts

$18.751

100+ parts

$15.376

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-

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1,016

$18.751

$15.376

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$21.765

100+ parts

$20.677

1k+ parts

$20.677

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2,500

$21.765

$20.677

$20.677

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Lixinc

USA . 11,105 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

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100+ parts

$12.664

1k+ parts

$11.727

10k+ parts

$11.727

350

-

$12.664

$11.727

$11.727

Overview

Unlock the full potential of your power management system with the BQ40Z80RSMR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. The BQ40Z80RSMR is a versatile Power Management IC that provides reliable performance and efficiency. With its wide range of applications, including battery management systems and power supply circuits, this IC offers exceptional value to customers looking for superior solutions. Trust Texas Instruments to deliver innovative technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product in various operating conditions.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on the PCB.

Package Shape: SQUARE

The square package shape provides efficient use of board space and facilitates easier placement on the PCB.

Nominal Supply Voltage (Vsup): 21.6 V

With a nominal supply voltage of 21.6 V, this product is suitable for a wide range of power management applications.

No. of Terminals: 32

The high number of terminals allows for versatile connectivity options and compatibility with various devices.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package style options provide flexibility in design and thermal management for improved performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable operation even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and reliable electrical connections.

Terminal Position: QUAD

The quad terminal position enables efficient routing of connections and improved signal integrity.

Maximum Seated Height: 1 mm

The low maximum seated height minimizes the overall profile of the product, making it suitable for compact designs.

Width (mm): 4 mm

The 4mm width ensures easy integration into standard PCB layouts for seamless compatibility.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

The power supply management circuit provides efficient power distribution and control for optimal performance.

Minimum Supply Voltage (Vsup): 2.2 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and devices.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature allows for proper soldering and reliability during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures strong solder joints for increased durability.

Length: 4 mm

The 4mm length facilitates easy placement on the PCB and allows for efficient heat dissipation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

No. of Channels: 7

The 7 channels offer versatility in power distribution and management for complex systems.

Terminal Form: NO LEAD

The no lead terminal form reduces potential soldering issues and improves the reliability of connections.

Terminal Pitch: 0.4 mm

The 0.4mm terminal pitch allows for compact design and high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 32 V

With a maximum supply voltage of 32 V, this product can handle a wide range of input voltages for versatile applications.

Adjustable Threshold: YES

The adjustable threshold feature allows for precise customization of voltage thresholds for specific power management needs.

Technical Specifications

Power Management ICs BQ40Z80RSMR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

7

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

32 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

21.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ40Z80RSMR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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