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BQ25898DYFFR

Texas Instruments

BQ25898DYFFR by Texas Instruments

BQ25898DYFFR by Texas Instruments is a Power Management IC with 42 terminals in a rectangular package. It operates b/w -40 to 125°C, supporting supply voltage from 3.9V to 14V. Ideal for automotive applications, it features a BUCK switcher configuration and adjustable threshold for power supply support circuits.

Median Price

$2.687

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,547 parts In-Stock

1+ parts

$2.687

100+ parts

$2.354

1k+ parts

$1.330

10k+ parts

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12,547

$2.687

$2.354

$1.330

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Distributors (In-Stock)

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Digiode

USA . 255 parts In-Stock

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$2.553

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$2.553

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TME

Poland . 6,000 parts In-Stock

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$1.940

6,000

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$1.940

Bristol Electronics

USA . 5,752 parts In-Stock

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5,752

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Vyrian

USA . 1,954 parts In-Stock

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Cyclops Electronics Ltd

UK . 98 parts In-Stock

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98

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Distributors (Availability)

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iBuyXS LLC

. 5,752 parts In-Stock

1+ parts

$1.400

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$1.400

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Corphita

USA . 4,258 parts In-Stock

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$2.418

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4,258

$2.418

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Parana Technologies

USA . 249 parts In-Stock

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$15.778

100+ parts

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$16.138

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249

$15.778

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$16.138

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DigiPath Technology Company

USA . 600 parts In-Stock

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$17.373

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600

$17.373

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ChromeModa Solutions

Germany . 4,395 parts In-Stock

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$17.728

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$14.537

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4,395

$17.728

$14.537

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IDEA Electronic Components Group

UK . 667 parts In-Stock

1+ parts

$17.728

100+ parts

$16.842

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$15.955

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667

$17.728

$16.842

$15.955

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AZTECH Wire

Italy . 548 parts In-Stock

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$18.000

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Lixinc

USA . 14,679 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,920 parts In-Stock

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BidChips

USA . 5,752 parts In-Stock

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Futuretech Components

Singapore . 5,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,280 parts In-Stock

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Northwest PG Solutions

USA . 981 parts In-Stock

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Native Components

USA . 735 parts In-Stock

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Overview

Unleash the power of your devices with the BQ25898DYFFR Power Management IC by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in a compact rectangular package. Perfect for automotive applications, this IC boasts a wide operating temperature range and low supply current, ensuring optimal performance even in challenging environments. Say goodbye to power supply issues and hello to seamless operation with the BQ25898DYFFR - the ultimate solution for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving time and effort during production.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh operating conditions while maintaining optimal performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this product to function reliably even in extreme cold environments.

Minimum Supply Voltage (Vsup): 3.9 V

The low minimum supply voltage requirement of 3.9V enables the product to operate efficiently even in low power conditions, making it suitable for a wide range of applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that this product meets the rigorous operating requirements of automotive applications, providing reliable performance in vehicles.

Technical Specifications

Power Management ICs BQ25898DYFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

2.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.415 mm

Maximum Supply Current (Isup):

3 mA

Maximum Supply Voltage (Vsup):

14 V

Minimum Supply Voltage (Vsup):

3.9 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.4 mm

Trade Compliance

BQ25898DYFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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