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BQ25886RGET

Texas Instruments

BQ25886RGET by Texas Instruments

BQ25886RGET by Texas Instruments is a Power Management IC with 24 terminals, operating from -40 to 85 °C. It features Boost switcher config, adjustable threshold, and supports supply voltage range of 3.9-6.2 V. Ideal for industrial applications requiring efficient power supply management in compact spaces.

Median Price

$3.670

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,780 parts In-Stock

1+ parts

$2.545

100+ parts

$2.230

1k+ parts

$1.260

10k+ parts

-

29,780

$2.545

$2.230

$1.260

-

DigiKey

USA . 255 parts In-Stock

1+ parts

$3.670

100+ parts

$2.291

1k+ parts

$2.065

10k+ parts

$1.980

255

$3.670

$2.291

$2.065

$1.980

Mouser Electronics

USA . 200 parts In-Stock

1+ parts

$3.670

100+ parts

$2.540

1k+ parts

-

10k+ parts

-

200

$3.670

$2.540

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 28 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

-

28

$1.930

-

-

-

Digiode

USA . 2,932 parts In-Stock

1+ parts

$2.418

100+ parts

-

1k+ parts

-

10k+ parts

-

2,932

$2.418

-

-

-

VNN

France . 25,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,113

-

-

-

-

Vyrian

USA . 2,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,143

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,141 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

-

2,141

$1.930

-

-

-

Continental Prestige Electronics

USA . 747 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

$1.891

747

$1.930

-

-

$1.891

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.930

-

-

-

Ampacity Inc.

Singapore . 9,655 parts In-Stock

1+ parts

$2.160

100+ parts

-

1k+ parts

-

10k+ parts

-

9,655

$2.160

-

-

-

Corphita

USA . 164 parts In-Stock

1+ parts

$2.290

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$2.290

-

-

-

Corohmni

South Africa . 382 parts In-Stock

1+ parts

$4.605

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$4.605

-

-

-

Parana Technologies

USA . 788 parts In-Stock

1+ parts

$8.454

100+ parts

-

1k+ parts

$9.099

10k+ parts

-

788

$8.454

-

$9.099

-

DigiPath Technology Company

USA . 2,173 parts In-Stock

1+ parts

$9.309

100+ parts

$8.564

1k+ parts

-

10k+ parts

-

2,173

$9.309

$8.564

-

-

ChromeModa Solutions

Germany . 5,113 parts In-Stock

1+ parts

$9.499

100+ parts

$7.789

1k+ parts

-

10k+ parts

-

5,113

$9.499

$7.789

-

-

IDEA Electronic Components Group

UK . 2,216 parts In-Stock

1+ parts

$9.499

100+ parts

$9.024

1k+ parts

$8.549

10k+ parts

-

2,216

$9.499

$9.024

$8.549

-

QUARKTWIN TECHNOLOGY LTD

USA . 2,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,825

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the BQ25886RGET by Texas Instruments. This top-of-the-line Power Management IC is designed to optimize performance and efficiency in a range of electronic devices. With a focus on quality and reliability, Texas Instruments has established itself as a leader in the industry, ensuring that this product meets the highest standards. From smartphones to tablets, the BQ25886RGET offers unmatched value, providing customers with enhanced functionality and seamless power management. Upgrade your devices today with the superior capabilities of Texas Instruments' BQ25886RGET.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and lightweight material makes it ideal for various applications.

Surface Mount:

YES - Easy and convenient installation on circuit boards.

Package Shape:

SQUARE - Space-efficient design for compact electronic devices.

Nominal Supply Voltage (Vsup):

5 V - Suitable for powering a wide range of devices.

No. of Terminals:

24 - Provides ample connectivity options for different components.

Package Style:

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Versatile package styles for different mounting and cooling options.

Maximum Operating Temperature:

85 °C - Can withstand high temperatures in industrial environments.

Minimum Operating Temperature:

40 °C - Ensures reliability in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Corrosion-resistant finish for long-term reliability.

Terminal Position:

QUAD - Allows for easy soldering and connection to other components.

Maximum Seated Height:

1 mm - Low profile design for space-constrained applications.

Width (mm):

4 mm - Compact size for integration into small devices.

Other IC type:

POWER SUPPLY MANAGEMENT CIRCUIT - Efficient management of power supply for optimal performance.

Minimum Supply Voltage (Vsup):

3.9 V - Allows for operation with lower voltage sources.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly process.

Peak Reflow Temperature °C:

260 - High temperature tolerance for soldering without damage.

Length:

4 mm - Balanced dimensions for a versatile range of applications.

Temperature Grade:

INDUSTRIAL - Suitable for harsh industrial environments.

Terminal Form:

NO LEAD - Environmentally friendly lead-free design.

Switcher Config:

BOOST - Efficient boost configuration for power management.

Terminal Pitch:

0.5 mm - Close terminal spacing for compact design requirements.

Maximum Supply Voltage (Vsup):

6.2 V - Can handle higher voltage inputs for flexibility.

Adjustable Threshold:

YES - Customizable threshold settings for specific requirements.

Technical Specifications

Power Management ICs BQ25886RGET attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6.2 V

Minimum Supply Voltage (Vsup):

3.9 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BOOST

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ25886RGET Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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