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BQ25881RGER

Texas Instruments

BQ25881RGER by Texas Instruments

BQ25881RGER by Texas Instruments is a Power Management IC with 24 terminals in a square package. It operates b/w -40 to 85°C, supporting a supply voltage range of 3.9V to 6.2V. Ideal for industrial applications requiring power supply support circuits with adjustable thresholds and surface mount capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,398 parts In-Stock

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6,398

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Digiode

USA . 4,411 parts In-Stock

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4,411

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Distributors (Availability)

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Ampacity Inc.

Singapore . 427 parts In-Stock

1+ parts

$0.500

100+ parts

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427

$0.500

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One Stop Electronics

USA . 839 parts In-Stock

1+ parts

$1.500

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839

$1.500

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Northwest PG Solutions

USA . 693 parts In-Stock

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$2.519

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693

$2.519

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Semicontronic

India . 1,459 parts In-Stock

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$5.500

100+ parts

$5.362

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$5.335

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1,459

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 847 parts In-Stock

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$10.166

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847

$10.166

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Parana Technologies

USA . 1,821 parts In-Stock

1+ parts

$11.862

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$12.260

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1,821

$11.862

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$12.260

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DigiPath Technology Company

USA . 784 parts In-Stock

1+ parts

$13.061

100+ parts

$12.017

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784

$13.061

$12.017

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ChromeModa Solutions

Germany . 6,725 parts In-Stock

1+ parts

$13.328

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$10.929

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6,725

$13.328

$10.929

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IDEA Electronic Components Group

UK . 1,901 parts In-Stock

1+ parts

$13.328

100+ parts

$12.662

1k+ parts

$11.995

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1,901

$13.328

$12.662

$11.995

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 1,016 parts In-Stock

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Native Components

USA . 601 parts In-Stock

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$2.221

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601

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$2.221

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Corohmni

South Africa . 292 parts In-Stock

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292

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Overview

Elevate your power management game with the BQ25881RGER by Texas Instruments. This high-quality Power Management IC offers unmatched reliability and efficiency, making it a top choice for a wide range of applications. From smartphones to laptops, this versatile chip ensures optimal charging performance, giving you peace of mind knowing your devices are always powered up and ready to go. Say goodbye to slow charging times and hello to seamless functionality with the BQ25881RGER.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable makes the IC easy to install and saves space on the PCB, making it ideal for compact designs.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on the PCB and allows for easy placement and routing of traces.

No. of Terminals: 24

With a high number of terminals, the IC can support multiple connections and functions, enhancing its versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function even in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Maximum Seated Height: 1 mm

The low seated height allows for compact and slim designs, making the IC suitable for applications with space constraints.

Width (mm): 4 mm

The compact width of the IC enables flexible placement on the PCB and allows for efficient use of space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC helps optimize power delivery and management, ensuring stable operation of connected devices.

Minimum Supply Voltage (Vsup): 3.9 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, making the IC versatile for different applications.

Maximum Time At Peak Reflow Temperature (s): 30

The IC can withstand peak reflow temperatures for up to 30 seconds, making it easy to integrate into the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures that the IC remains stable during soldering processes, guaranteeing reliable connections.

Length: 4 mm

The compact length of the IC allows for efficient use of space on the PCB and enables flexible placement in designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the IC can operate reliably in harsh industrial environments, ensuring consistent performance.

No. of Channels: 2

With two channels, the IC can manage multiple power sources or functions simultaneously, enhancing its utility in complex systems.

Terminal Form: NO LEAD

The use of no lead terminals simplifies the soldering process and reduces the risk of lead contamination, improving environmental and health safety.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the PCB, enabling compact and efficient designs.

Maximum Supply Voltage (Vsup): 6.2 V

The high maximum supply voltage provides flexibility in power source selection and compatibility with a wide range of devices.

Adjustable Threshold: YES

The ability to adjust thresholds allows for customization and optimization of the IC's performance, making it adaptable to various applications and requirements.

Technical Specifications

Power Management ICs BQ25881RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6.2 V

Minimum Supply Voltage (Vsup):

3.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ25881RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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