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BQ25872YFFR

Texas Instruments

BQ25872YFFR by Texas Instruments

BQ25872YFFR by Texas Instruments is a Power Management IC with 42 terminals in a rectangular package. It operates b/w -40 to 85°C, supporting supply voltages from 2.8V to 6V. Ideal for industrial applications requiring power supply support circuits with adjustable thresholds.

Median Price

$2.767

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,500 parts In-Stock

1+ parts

$2.767

100+ parts

$2.425

1k+ parts

$1.370

10k+ parts

-

5,500

$2.767

$2.425

$1.370

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,243 parts In-Stock

1+ parts

$2.629

100+ parts

-

1k+ parts

-

10k+ parts

-

3,243

$2.629

-

-

-

Vyrian

USA . 2,060 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,060

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 27 parts In-Stock

1+ parts

$0.542

100+ parts

-

1k+ parts

-

10k+ parts

-

27

$0.542

-

-

-

Northwest PG Solutions

USA . 40 parts In-Stock

1+ parts

$0.596

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$0.596

-

-

-

Semicontronic

India . 5,367 parts In-Stock

1+ parts

$2.350

100+ parts

$2.291

1k+ parts

$2.280

10k+ parts

-

5,367

$2.350

$2.291

$2.280

-

Corphita

USA . 4,714 parts In-Stock

1+ parts

$2.490

100+ parts

-

1k+ parts

-

10k+ parts

-

4,714

$2.490

-

-

-

Corohmni

South Africa . 435 parts In-Stock

1+ parts

$2.767

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$2.767

-

-

-

Ampacity Inc.

Singapore . 5,028 parts In-Stock

1+ parts

$5.120

100+ parts

-

1k+ parts

-

10k+ parts

-

5,028

$5.120

-

-

-

Microchip USA

USA . 1,348 parts In-Stock

1+ parts

$11.960

100+ parts

$11.890

1k+ parts

$11.850

10k+ parts

$11.810

1,348

$11.960

$11.890

$11.850

$11.810

AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$13.600

100+ parts

-

1k+ parts

-

10k+ parts

-

528

$13.600

-

-

-

Parana Technologies

USA . 714 parts In-Stock

1+ parts

$16.366

100+ parts

-

1k+ parts

$16.664

10k+ parts

-

714

$16.366

-

$16.664

-

DigiPath Technology Company

USA . 1,423 parts In-Stock

1+ parts

$18.021

100+ parts

-

1k+ parts

-

10k+ parts

-

1,423

$18.021

-

-

-

ChromeModa Solutions

Germany . 3,712 parts In-Stock

1+ parts

$18.389

100+ parts

$15.079

1k+ parts

-

10k+ parts

-

3,712

$18.389

$15.079

-

-

IDEA Electronic Components Group

UK . 603 parts In-Stock

1+ parts

$18.389

100+ parts

$17.470

1k+ parts

$16.550

10k+ parts

-

603

$18.389

$17.470

$16.550

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Overview

Unlock the power of efficient energy management with the Texas Instruments BQ25872YFFR Power Management IC. Manufactured by a trusted industry leader, this high-quality component offers a wide range of applications for power supply support circuits. With its compact design and adjustable threshold feature, customers can enjoy optimized performance and maximum convenience. Experience the reliability and innovation that Texas Instruments is known for, and take your power management to the next level with the BQ25872YFFR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is reliable, cost-effective, and allows for a compact design.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility with standard PCB layouts.

No. of Terminals: 42

High number of terminals provide flexibility for connecting to various components.

Package Style (Meter): GRID ARRAY

Grid array style offers efficient routing of connections for improved performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in challenging conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both hot and cold environments.

Terminal Finish: TIN SILVER COPPER

Multiple terminal finish options enhance connectivity and resist corrosion.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient heat dissipation.

Maximum Seated Height: 0.415 mm

Low seated height enables a compact and space-saving design.

Width (mm): 2.4 mm

Narrow width allows for placement in tight spaces on the PCB.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specific IC type indicates specialized functionality for power management applications.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum supply voltage allows for operation in low-power scenarios.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables secure solder joints for long-term use.

Length: 2.8 mm

Compact length contributes to a smaller overall footprint on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures suitability for harsh operating environments.

Terminal Form: BALL

Ball terminal form allows for easy and reliable solder connections.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting for efficient use of space.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage supports a wide range of power input requirements.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization and optimization of power management.

Technical Specifications

Power Management ICs BQ25872YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

2.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.415 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.4 mm

Trade Compliance

BQ25872YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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