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BQ25710RSNR

Texas Instruments

BQ25710RSNR by Texas Instruments

BQ25710RSNR by Texas Instruments is a Power Management IC with 32 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial applications. Featuring a buck-boost switcher config, it supports supply voltages from 3.5V to 26V and has an adjustable threshold for power supply management circuits.

Median Price

$4.080

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,254 parts In-Stock

1+ parts

$2.868

100+ parts

$2.513

1k+ parts

$1.420

10k+ parts

-

17,254

$2.868

$2.513

$1.420

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Mouser Electronics

USA . 2,719 parts In-Stock

1+ parts

$4.080

100+ parts

$2.840

1k+ parts

-

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2,719

$4.080

$2.840

-

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DigiKey

USA . 2,353 parts In-Stock

1+ parts

$4.080

100+ parts

$2.566

1k+ parts

$2.293

10k+ parts

$2.213

2,353

$4.080

$2.566

$2.293

$2.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$2.171

100+ parts

-

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27

$2.171

-

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Digiode

USA . 4,248 parts In-Stock

1+ parts

$2.725

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4,248

$2.725

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VNN

France . 34,698 parts In-Stock

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34,698

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Chip Stock

USA . 30,520 parts In-Stock

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30,520

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Vyrian

USA . 4,265 parts In-Stock

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4,265

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,637 parts In-Stock

1+ parts

$2.171

100+ parts

-

1k+ parts

-

10k+ parts

$2.128

4,637

$2.171

-

-

$2.128

Argo Parts USA

USA . 1,339 parts In-Stock

1+ parts

$2.171

100+ parts

-

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1,339

$2.171

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.171

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-

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1,000

$2.171

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Ampacity Inc.

Singapore . 16,993 parts In-Stock

1+ parts

$2.440

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16,993

$2.440

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Corphita

USA . 4,513 parts In-Stock

1+ parts

$2.581

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-

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4,513

$2.581

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Parana Technologies

USA . 1,825 parts In-Stock

1+ parts

$15.305

100+ parts

-

1k+ parts

$15.699

10k+ parts

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1,825

$15.305

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$15.699

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$16.110

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639

$16.110

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DigiPath Technology Company

USA . 549 parts In-Stock

1+ parts

$16.853

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549

$16.853

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ChromeModa Solutions

Germany . 1,734 parts In-Stock

1+ parts

$17.197

100+ parts

$14.102

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1,734

$17.197

$14.102

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IDEA Electronic Components Group

UK . 155 parts In-Stock

1+ parts

$17.197

100+ parts

$16.337

1k+ parts

$15.477

10k+ parts

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155

$17.197

$16.337

$15.477

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Lixinc

USA . 11,827 parts In-Stock

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11,827

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A-Z Elektronik GmbH

Germany . 11,411 parts In-Stock

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11,411

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Futuretech Components

Singapore . 6,000 parts In-Stock

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6,000

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Alle Elektronik GmbH

Germany . 4,543 parts In-Stock

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4,543

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Authorized Procurement Solutions

USA . 310 parts In-Stock

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310

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Overview

Discover the cutting-edge BQ25710RSNR Power Management IC by Texas Instruments, renowned for its superior quality and reliability. Ideal for a wide range of applications, this innovative product offers unparalleled efficiency and performance. With its advanced features and robust design, customers can expect seamless integration and enhanced functionality, making it the perfect choice for all power supply management needs. Experience the value and benefits of Texas Instruments' expertise with the BQ25710RSNR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the power management IC.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and space.

Package Shape: SQUARE

Allows for a compact design, ideal for applications where space is limited.

No. of Terminals: 32

Provides a sufficient number of connection points for various inputs and outputs.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold conditions without sacrificing functionality.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Offers enhanced conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Enables easy soldering and connection of the power management IC on the PCB.

Maximum Seated Height: 0.8 mm

Low profile design allows for installation in slim devices or tight spaces.

Width (mm): 4 mm

Compact size makes it suitable for applications with limited PCB real estate.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for efficient power supply management, ensuring optimal performance.

Minimum Supply Voltage (Vsup): 3.5 V

Compatible with a wide range of input voltages, making it versatile in different applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for proper soldering and reflow processes during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering, ensuring reliable solder joints.

Length: 4 mm

Compact length suits applications where space is at a premium.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring robust performance.

No. of Channels: 2

Dual-channel design allows for independent control and monitoring of multiple power outputs.

Terminal Form: NO LEAD

Lead-free design complies with environmental regulations and avoids potential health hazards.

Switcher Config: BUCK-BOOST

Efficient buck-boost configuration enables voltage regulation and conversion for diverse applications.

Terminal Pitch: 0.4 mm

Fine pitch spacing facilitates high-density PCB layout and improved signal integrity.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level ensures safe storage and handling of the power management IC.

Maximum Supply Voltage (Vsup): 26 V

Supports a wide input voltage range, catering to different power supply requirements.

Adjustable Threshold: YES

Allows for customization of voltage thresholds, providing flexibility in power management settings.

Technical Specifications

Power Management ICs BQ25710RSNR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

3.5 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ25710RSNR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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