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BQ25123YFPT

Texas Instruments

BQ25123YFPT by Texas Instruments

BQ25123YFPT by Texas Instruments is a Power Management IC with 25 terminals, operating b/w -40 to 85°C. It features a nominal voltage of 5V, adjustable threshold, and industrial temperature grade suitability. Ideal for power supply management circuits in applications requiring precise voltage regulation and thermal performance.

Median Price

$4.750

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$3.394

100+ parts

$2.974

1k+ parts

$1.680

10k+ parts

-

2,000

$3.394

$2.974

$1.680

-

Mouser Electronics

USA . 500 parts In-Stock

1+ parts

$4.750

100+ parts

$3.020

1k+ parts

$2.650

10k+ parts

$2.620

500

$4.750

$3.020

$2.650

$2.620

DigiKey

USA . 248 parts In-Stock

1+ parts

$4.750

100+ parts

$3.013

1k+ parts

$2.729

10k+ parts

$2.622

248

$4.750

$3.013

$2.729

$2.622

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 76 parts In-Stock

1+ parts

$3.224

100+ parts

-

1k+ parts

-

10k+ parts

-

76

$3.224

-

-

-

Vyrian

USA . 2,826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,826

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 110 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

-

10k+ parts

$0.266

110

$0.277

-

-

$0.266

Northwest PG Solutions

USA . 477 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

477

$0.305

-

-

$0.269

Semicontronic

India . 821 parts In-Stock

1+ parts

$2.010

100+ parts

$1.960

1k+ parts

$1.950

10k+ parts

-

821

$2.010

$1.960

$1.950

-

Ampacity Inc.

Singapore . 765 parts In-Stock

1+ parts

$2.010

100+ parts

-

1k+ parts

-

10k+ parts

-

765

$2.010

-

-

-

Corohmni

South Africa . 357 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

10k+ parts

-

357

$2.370

-

-

-

Corphita

USA . 1,438 parts In-Stock

1+ parts

$3.055

100+ parts

-

1k+ parts

-

10k+ parts

-

1,438

$3.055

-

-

-

Parana Technologies

USA . 160 parts In-Stock

1+ parts

$21.800

100+ parts

-

1k+ parts

$22.267

10k+ parts

-

160

$21.800

-

$22.267

-

DigiPath Technology Company

USA . 2,175 parts In-Stock

1+ parts

$24.004

100+ parts

$22.084

1k+ parts

-

10k+ parts

-

2,175

$24.004

$22.084

-

-

ChromeModa Solutions

Germany . 2,295 parts In-Stock

1+ parts

$24.494

100+ parts

$20.085

1k+ parts

-

10k+ parts

-

2,295

$24.494

$20.085

-

-

IDEA Electronic Components Group

UK . 1,409 parts In-Stock

1+ parts

$24.494

100+ parts

$23.269

1k+ parts

$22.045

10k+ parts

-

1,409

$24.494

$23.269

$22.045

-

Overview

Experience superior power management with the BQ25123YFPT by Texas Instruments, a cutting-edge Power Management IC. Crafted with precision and quality by one of the industry's leading manufacturers, this innovative product offers unrivaled efficiency and reliability. Ideal for a wide range of applications, this IC ensures optimal performance while maximizing energy savings. Embrace the future of power management technology with the BQ25123YFPT and enjoy seamless integration, enhanced functionality, and unparalleled convenience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable, this product is easy to install on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage is a common standard in many electronic devices, ensuring compatibility with a wide range of applications.

No. of Terminals: 25

Having 25 terminals provides ample connectivity options for various components and peripherals, enhancing the versatility of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand challenging environmental conditions, making it suitable for industrial use.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper ensures good conductivity and corrosion resistance, maintaining reliable performance over time.

Maximum Seated Height: 0.5 mm

With a maximum seated height of 0.5 mm, this product has a low profile design, making it suitable for slim and compact devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the product can operate in harsh industrial environments with high reliability and performance.

Technical Specifications

Power Management ICs BQ25123YFPT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B25

JESD-609 Code:

e1

Length:

2.53 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.12V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.468 mm

Trade Compliance

BQ25123YFPT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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