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BQ25121YFPR

Texas Instruments

BQ25121YFPR by Texas Instruments

BQ25121YFPR by Texas Instruments is a Power Management IC with 25 terminals, operating temperature range of -40 to 85°C. It features a nominal voltage of 5V, adjustable threshold, and industrial temperature grade. Ideal for power supply management circuits in applications requiring precise voltage regulation and thermal performance.

Median Price

$2.112

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,996 parts In-Stock

1+ parts

$4.072

100+ parts

$3.568

1k+ parts

$2.016

10k+ parts

-

1,996

$4.072

$3.568

$2.016

-

Verical

USA . 1,823 parts In-Stock

1+ parts

-

100+ parts

$0.152

1k+ parts

$0.144

10k+ parts

-

1,823

-

$0.152

$0.144

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,788 parts In-Stock

1+ parts

$3.868

100+ parts

-

1k+ parts

-

10k+ parts

-

2,788

$3.868

-

-

-

Vyrian

USA . 6,139 parts In-Stock

1+ parts

-

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-

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6,139

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-

-

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Martec Srl

Italy . 2,584 parts In-Stock

1+ parts

-

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2,584

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 574 parts In-Stock

1+ parts

$0.686

100+ parts

-

1k+ parts

-

10k+ parts

-

574

$0.686

-

-

-

Northwest PG Solutions

USA . 2,297 parts In-Stock

1+ parts

$0.755

100+ parts

-

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-

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2,297

$0.755

-

-

-

Corphita

USA . 2,592 parts In-Stock

1+ parts

$3.665

100+ parts

-

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2,592

$3.665

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-

-

AZTECH Wire

Italy . 888 parts In-Stock

1+ parts

$15.060

100+ parts

-

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-

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-

888

$15.060

-

-

-

Microchip USA

USA . 328 parts In-Stock

1+ parts

$18.140

100+ parts

$18.080

1k+ parts

$18.080

10k+ parts

$18.020

328

$18.140

$18.080

$18.080

$18.020

Parana Technologies

USA . 1,279 parts In-Stock

1+ parts

$21.806

100+ parts

-

1k+ parts

$22.280

10k+ parts

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1,279

$21.806

-

$22.280

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ChromeModa Solutions

Germany . 4,412 parts In-Stock

1+ parts

$24.501

100+ parts

$20.091

1k+ parts

-

10k+ parts

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4,412

$24.501

$20.091

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IDEA Electronic Components Group

UK . 1,697 parts In-Stock

1+ parts

$24.501

100+ parts

$23.276

1k+ parts

$22.051

10k+ parts

-

1,697

$24.501

$23.276

$22.051

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Lixinc

USA . 17,204 parts In-Stock

1+ parts

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17,204

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QUARKTWIN TECHNOLOGY LTD

USA . 14,618 parts In-Stock

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14,618

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A-Z Elektronik GmbH

Germany . 6,161 parts In-Stock

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6,161

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Alle Elektronik GmbH

Germany . 4,107 parts In-Stock

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4,107

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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3,500

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-

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DigiPath Technology Company

USA . 447 parts In-Stock

1+ parts

-

100+ parts

$22.090

1k+ parts

-

10k+ parts

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447

-

$22.090

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-

Overview

Elevate your power management solutions with the BQ25121YFPR by Texas Instruments. Known for their top-quality products, Texas Instruments delivers excellence in Power Management ICs. This versatile device is perfect for a wide range of applications, offering customers unrivaled efficiency and reliability. With its compact size and advanced features, the BQ25121YFPR provides exceptional value, making it the ideal choice for all your power management needs. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Easy to integrate onto circuit boards during manufacturing, saving time and effort.

Nominal Supply Voltage (Vsup): 5 V

Compatible with many common power sources and devices, making it versatile in application.

No. of Terminals: 25

Provides ample connectivity options for various input and output connections.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ideal for industrial environments or applications where heat may be a concern.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and resistance to corrosion, maintaining optimal performance over time.

Width (mm): 2.468 mm

Compact size allows for space-saving design in electronic devices.

Minimum Supply Voltage (Vsup): 3.4 V

Can operate at lower voltages, increasing compatibility with various power sources.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial settings where ruggedness and reliability are important.

Adjustable Threshold: YES

Allows for customization and fine-tuning of voltage thresholds to suit specific requirements.

Technical Specifications

Power Management ICs BQ25121YFPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B25

JESD-609 Code:

e1

Length:

2.53 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.468 mm

Trade Compliance

BQ25121YFPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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