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BQ25121AYFPR

Texas Instruments

BQ25121AYFPR by Texas Instruments

BQ25121AYFPR by Texas Instruments is a Power Management IC with 25 terminals, operating b/w -40 to 85°C. It supports a supply voltage range of 3.4V to 5.5V and has three channels for power supply support circuits. With a very thin profile and fine pitch package style, it is ideal for industrial applications requiring precise power management.

Median Price

$2.969

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 33,971 parts In-Stock

1+ parts

$2.969

100+ parts

$2.602

1k+ parts

$1.470

10k+ parts

-

33,971

$2.969

$2.602

$1.470

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mobius Materials

USA . 2,872 parts In-Stock

1+ parts

$2.810

100+ parts

$2.260

1k+ parts

-

10k+ parts

-

2,872

$2.810

$2.260

-

-

Digiode

USA . 3,753 parts In-Stock

1+ parts

$2.821

100+ parts

-

1k+ parts

-

10k+ parts

-

3,753

$2.821

-

-

-

Chip Stock

USA . 93,200 parts In-Stock

1+ parts

-

100+ parts

-

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93,200

-

-

-

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Vyrian

USA . 6,774 parts In-Stock

1+ parts

-

100+ parts

-

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6,774

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-

-

-

Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

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2,000

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 452 parts In-Stock

1+ parts

$0.138

100+ parts

-

1k+ parts

-

10k+ parts

$0.132

452

$0.138

-

-

$0.132

Northwest PG Solutions

USA . 523 parts In-Stock

1+ parts

$0.152

100+ parts

-

1k+ parts

-

10k+ parts

$0.134

523

$0.152

-

-

$0.134

Corphita

USA . 3,385 parts In-Stock

1+ parts

$2.672

100+ parts

-

1k+ parts

-

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-

3,385

$2.672

-

-

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Parana Technologies

USA . 2,198 parts In-Stock

1+ parts

$7.471

100+ parts

-

1k+ parts

$7.960

10k+ parts

-

2,198

$7.471

-

$7.960

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IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$8.394

100+ parts

$7.974

1k+ parts

$7.555

10k+ parts

-

961

$8.394

$7.974

$7.555

-

ChromeModa Solutions

Germany . 947 parts In-Stock

1+ parts

$8.394

100+ parts

$6.883

1k+ parts

-

10k+ parts

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947

$8.394

$6.883

-

-

AZTECH Wire

Italy . 526 parts In-Stock

1+ parts

$15.580

100+ parts

-

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526

$15.580

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QUARKTWIN TECHNOLOGY LTD

USA . 23,320 parts In-Stock

1+ parts

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23,320

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A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

1+ parts

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7,500

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Lixinc

USA . 5,406 parts In-Stock

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5,406

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Technoshack Inc. (Excess)

Canada . 2,400 parts In-Stock

1+ parts

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2,400

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DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

-

100+ parts

$7.568

1k+ parts

-

10k+ parts

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798

-

$7.568

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-

iodParts Technologies Inc.

India . 192 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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192

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Overview

Elevate your power management capabilities with the BQ25121AYFPR by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the field of Power Management ICs. This versatile device, featuring a compact rectangular package shape and grid array style, offers customers a seamless solution for their power supply support circuit needs. With an adjustable threshold, very thin profile, and fine pitch, this product provides unmatched flexibility and efficiency. Trust Texas Instruments to provide you with the best-in-class power management solutions for all your industrial applications.

Feature Benefit Bullets

Surface Mount: YES

The ability to be mounted directly onto the surface of a PCB saves space and simplifies assembly, making this product convenient for manufacturing.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage allows for compatibility with a wide range of electronic devices, making it versatile for various applications.

No. of Terminals: 25

With 25 terminals, this product offers ample connection options for interfacing with other components in a system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold conditions without compromising functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package with a thin profile and fine pitch design enhances thermal performance and reduces signal interference, improving overall product reliability.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections over time.

Width (mm): 2.468 mm

The compact width of 2.468mm saves space on the PCB and allows for high-density mounting, making it suitable for miniaturized electronic devices.

Minimum Supply Voltage (Vsup): 3.4 V

The low minimum supply voltage of 3.4V allows for operation with a wide range of power sources, making it versatile for different system requirements.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures reliable soldering during assembly, improving product durability.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environmental conditions and operate reliably in rugged settings.

No. of Channels: 3

With 3 channels, this power management IC can support multiple power supply circuits simultaneously, enhancing system performance and efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows for safe operation within a specified range, protecting the device from potential damage due to overvoltage.

Adjustable Threshold: YES

The ability to adjust thresholds allows for customization of power management settings, catering to specific system requirements for optimal performance.

Technical Specifications

Power Management ICs BQ25121AYFPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B25

JESD-609 Code:

e1

Length:

2.53 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.468 mm

Trade Compliance

BQ25121AYFPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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