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BQ24013DRCRG4

Texas Instruments

BQ24013DRCRG4 by Texas Instruments

BQ24013DRCRG4 by Texas Instruments is a Power Management IC with 10 terminals, operating temperature range of -40 to 85 °C. It supports supply voltages from 3V to 16.5V and has a max supply current of 5mA. Ideal for industrial applications requiring compact, surface-mount power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 40,595 parts In-Stock

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40,595

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Vyrian

USA . 6,954 parts In-Stock

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6,954

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Digiode

USA . 3,616 parts In-Stock

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3,616

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Semi Source

USA . 388 parts In-Stock

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388

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One Stop Electronics

USA . 1,103 parts In-Stock

1+ parts

$3.500

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-

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1,103

$3.500

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AZTECH Wire

Italy . 218 parts In-Stock

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$14.180

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218

$14.180

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Parana Technologies

USA . 106 parts In-Stock

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$20.957

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$21.168

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106

$20.957

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$21.168

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DigiPath Technology Company

USA . 1,442 parts In-Stock

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$23.076

100+ parts

$21.230

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1,442

$23.076

$21.230

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ChromeModa Solutions

Germany . 613 parts In-Stock

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$23.547

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$19.309

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613

$23.547

$19.309

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IDEA Electronic Components Group

UK . 377 parts In-Stock

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$23.547

100+ parts

$22.370

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$21.192

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377

$23.547

$22.370

$21.192

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Component Stockers USA

USA . 1,090 parts In-Stock

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$23.750

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1,090

$23.750

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Native Components

USA . 109 parts In-Stock

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$64.230

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$61.661

109

$64.230

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$61.661

Northwest PG Solutions

USA . 227 parts In-Stock

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$70.653

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227

$70.653

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GreenTree Electronics

Israel . 15,656 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Microchip USA

USA . 1,407 parts In-Stock

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Corphita

USA . 778 parts In-Stock

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778

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A-Z Elektronik GmbH

Germany . 464 parts In-Stock

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464

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Overview

Enhance your power management solutions with the BQ24013DRCRG4 from Texas Instruments. With a reputation for excellence, Texas Instruments delivers cutting-edge technology in the form of Power Management ICs like this one. Designed for industrial applications, this compact and efficient device offers a wide supply voltage range, minimal supply current, and a small outline package for easy integration. Trust Texas Instruments to provide reliable and innovative solutions for all your power management needs. Experience the difference with the BQ24013DRCRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the longevity of the product.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 4.5 V

The 4.5V supply voltage is within a commonly used range in various electronic devices, making it compatible with a wide range of applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style allows for efficient heat dissipation and space-saving design in compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliable performance under harsh conditions.

Minimum Operating Temperature: -40 °C

The product can operate in extremely cold temperatures as low as -40°C, making it suitable for a wide range of operating environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring stable electrical connections over time.

Maximum Supply Current (Isup): 5 mA

The maximum supply current of 5 mA ensures low power consumption, making this product energy-efficient and cost-effective for power management applications.

Technical Specifications

Power Management ICs BQ24013DRCRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/16.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ24013DRCRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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