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ALVC04PWLE

Texas Instruments

ALVC04PWLE by Texas Instruments

The Texas Instruments ALVC04PWLE is a logic gate with 6 functions, featuring a propagation delay of 3.3 ns. With a small outline and thin profile package style, it operates in industrial temperature grades from -40 to 85°C. Ideal for applications requiring fast signal processing in compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,762 parts In-Stock

1+ parts

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4,762

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Digiode

USA . 2,831 parts In-Stock

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2,831

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 830 parts In-Stock

1+ parts

$0.037

100+ parts

-

1k+ parts

-

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$0.036

830

$0.037

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-

$0.036

One Stop Electronics

USA . 597 parts In-Stock

1+ parts

$4.000

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-

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597

$4.000

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AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$13.146

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453

$13.146

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Parana Technologies

USA . 310 parts In-Stock

1+ parts

$13.846

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$14.327

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310

$13.846

-

$14.327

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DigiPath Technology Company

USA . 1,368 parts In-Stock

1+ parts

$15.246

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1,368

$15.246

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ChromeModa Solutions

Germany . 4,614 parts In-Stock

1+ parts

$15.557

100+ parts

$12.757

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4,614

$15.557

$12.757

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IDEA Electronic Components Group

UK . 320 parts In-Stock

1+ parts

$15.557

100+ parts

$14.779

1k+ parts

$14.001

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320

$15.557

$14.779

$14.001

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Corphita

USA . 3,494 parts In-Stock

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3,494

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Northwest PG Solutions

USA . 1,305 parts In-Stock

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1,305

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Overview

Elevate your electronic designs with the ALVC04PWLE by Texas Instruments, a high-quality logic gates component that offers unmatched reliability and performance. Designed for a wide range of applications, this versatile product boasts six functions in a compact and durable package. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this logic gate will deliver superior results in your projects. Experience the value and benefits of this innovative solution, from its fast propagation delay to its industrial-grade temperature tolerance. Upgrade your designs today with the ALVC04PWLE and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the logic gates, making them suitable for a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on circuit boards.

No. of Functions: 6

With 6 functions in one package, this product offers versatility and efficiency in circuit design.

Propagation Delay (tpd): 3.3 ns

The low propagation delay ensures fast signal processing, making this product ideal for high-speed applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making these logic gates energy-efficient and reliable.

Technical Specifications

Logic Gates ALVC04PWLE attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ALVC04PWLE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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