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ADS6444MRGCTEP

Texas Instruments

ADS6444MRGCTEP by Texas Instruments

The Texas Instruments ADS6444MRGCTEP is a 14-bit ADC with 4 analog input channels, operating at a sample rate of 125 MHz. It features a max linearity error of 0.0305% and supports various output formats like serial. Ideal for military applications due to its temperature grade and low power supply requirement of 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,161 parts In-Stock

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Digiode

USA . 1,046 parts In-Stock

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1,046

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Distributors (Availability)

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Native Components

USA . 347 parts In-Stock

1+ parts

$0.692

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347

$0.692

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Northwest PG Solutions

USA . 800 parts In-Stock

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$0.761

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800

$0.761

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One Stop Electronics

USA . 490 parts In-Stock

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$13.000

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490

$13.000

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AZTECH Wire

Italy . 536 parts In-Stock

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$15.873

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536

$15.873

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Parana Technologies

USA . 181 parts In-Stock

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$23.148

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$23.784

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181

$23.148

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$23.784

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DigiPath Technology Company

USA . 2,299 parts In-Stock

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$25.489

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$23.450

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2,299

$25.489

$23.450

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ChromeModa Solutions

Germany . 2,243 parts In-Stock

1+ parts

$26.009

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$21.327

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$26.009

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IDEA Electronic Components Group

UK . 122 parts In-Stock

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$26.009

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$24.709

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$23.408

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122

$26.009

$24.709

$23.408

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Component Stockers USA

USA . 321 parts In-Stock

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$99.990

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321

$99.990

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Corphita

USA . 1,229 parts In-Stock

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Overview

Experience unparalleled precision and performance with the ADS6444MRGCTEP by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers cutting-edge technology that ensures top-notch quality and reliability. This versatile product is ideal for a wide range of applications, providing customers with exceptional value and benefits. Elevate your projects with the ADS6444MRGCTEP and discover the advantages of seamless integration, high-speed sampling, and superior accuracy. Trust Texas Instruments to exceed your expectations and take your designs to the next level. Choose innovation, choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

No. of Analog In Channels: 4

Allows for the conversion of up to 4 analog signals simultaneously, increasing efficiency in data acquisition.

Surface Mount: YES

Simplify the assembly process and saves space on the PCB, ideal for compact designs.

No. of Bits: 14

Offers high resolution for accurate conversion of analog signals to digital data.

Maximum Linearity Error (EL): 0.0305 %

Ensures precision and accuracy in the conversion process, leading to reliable data output.

Power Supplies (V): 3.3

Operates at a standard voltage, making it compatible with a wide range of systems.

No. of Terminals: 64

Provides ample connectivity options for integration into various circuits and systems.

Maximum Operating Temperature: 125 °C

Suitable for operation in high-temperature environments, increasing versatility of the product.

Minimum Operating Temperature: -55 °C

Capable of functioning well in low-temperature conditions, ensuring reliability in various settings.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed, enhancing efficiency in operation.

Technical Specifications

Analog-to-Digital Converters ADS6444MRGCTEP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0305 %

Sample Rate:

125 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6444MRGCTEP Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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