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ADS6424IRGC25

Texas Instruments

ADS6424IRGC25 by Texas Instruments

The Texas Instruments ADS6424IRGC25 is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 105 MHz. It features a max linearity error of 0.0537%, suitable for industrial applications requiring precise analog-to-digital conversion in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,034 parts In-Stock

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7,034

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Digiode

USA . 3,644 parts In-Stock

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3,644

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Distributors (Availability)

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AZTECH Wire

Italy . 379 parts In-Stock

1+ parts

$13.604

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379

$13.604

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Native Components

USA . 555 parts In-Stock

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$18.375

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555

$18.375

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Parana Technologies

USA . 1,105 parts In-Stock

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$19.290

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$19.320

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1,105

$19.290

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Northwest PG Solutions

USA . 1,362 parts In-Stock

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$20.212

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$18.191

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1,362

$20.212

$18.191

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DigiPath Technology Company

USA . 291 parts In-Stock

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$21.241

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$19.541

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291

$21.241

$19.541

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ChromeModa Solutions

Germany . 6,003 parts In-Stock

1+ parts

$21.674

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$17.773

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6,003

$21.674

$17.773

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IDEA Electronic Components Group

UK . 697 parts In-Stock

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$21.674

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$20.590

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$19.507

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697

$21.674

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$19.507

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One Stop Electronics

USA . 1,037 parts In-Stock

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$37.000

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$37.000

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Corphita

USA . 867 parts In-Stock

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Microchip USA

USA . 234 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the ADS6424IRGC25 by Texas Instruments. Renowned for their top-notch quality and cutting-edge technology, Texas Instruments delivers unmatched precision and reliability in every product. Perfect for a wide range of applications, this ADC boasts 12 bits of resolution and a sample rate of 105 MHz, ensuring accurate and efficient data conversion. With a compact and durable package design, this device is ideal for industrial environments where performance and consistency are paramount. Trust Texas Instruments to provide you with the tools you need to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the converter, ensuring reliable performance in various operating conditions.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and versatility in applications.

Surface Mount: YES

The surface mount capability makes installation and integration of the converter easier and more convenient, saving time and effort during the manufacturing process.

No. of Bits: 12

With 12 bits of resolution, this converter can provide high precision and accuracy in converting analog signals to digital data, making it suitable for demanding applications.

Maximum Linearity Error (EL): 0.0537 %

The low linearity error ensures that the converted digital data closely represents the original analog signal, leading to more accurate and reliable results.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V allows for compatibility with a wide range of systems and devices, making it a versatile choice for various applications.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options and flexibility for interfacing with other components or systems, enhancing the overall functionality of the converter.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and thin profile design enhances thermal performance, compactness, and reliability of the converter, making it suitable for space-constrained environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the converter to function reliably in harsh environmental conditions, expanding its range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance ensures the converter's performance even in extremely cold environments, making it suitable for a wide range of operating conditions.

Technical Specifications

Analog-to-Digital Converters ADS6424IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0537 %

Sample Rate:

105 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6424IRGC25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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