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ADS6145IRHB25

Texas Instruments

ADS6145IRHB25 by Texas Instruments

The Texas Instruments ADS6145IRHB25 is a 14-bit ADC with 125 MHz sample rate, 0.0275% linearity error, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact chip carrier package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,860 parts In-Stock

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7,860

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Digiode

USA . 4,814 parts In-Stock

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4,814

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,598 parts In-Stock

1+ parts

$6.000

100+ parts

-

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1,598

$6.000

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AZTECH Wire

Italy . 211 parts In-Stock

1+ parts

$6.331

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211

$6.331

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Parana Technologies

USA . 1,783 parts In-Stock

1+ parts

$7.182

100+ parts

-

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$7.689

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1,783

$7.182

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$7.689

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DigiPath Technology Company

USA . 88 parts In-Stock

1+ parts

$7.909

100+ parts

$7.276

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88

$7.909

$7.276

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IDEA Electronic Components Group

UK . 2,345 parts In-Stock

1+ parts

$8.070

100+ parts

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$7.263

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2,345

$8.070

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$7.263

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ChromeModa Solutions

Germany . 2,096 parts In-Stock

1+ parts

$8.070

100+ parts

$6.617

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2,096

$8.070

$6.617

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Native Components

USA . 858 parts In-Stock

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$9.950

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858

$9.950

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Northwest PG Solutions

USA . 1,438 parts In-Stock

1+ parts

$10.945

100+ parts

$9.850

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1,438

$10.945

$9.850

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Component Stockers USA

USA . 453 parts In-Stock

1+ parts

$99.990

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453

$99.990

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Corphita

USA . 4,773 parts In-Stock

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4,773

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Microchip USA

USA . 982 parts In-Stock

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982

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Overview

Experience unparalleled precision and reliability with the ADS6145IRHB25 by Texas Instruments, a leading manufacturer in the industry. This Analog-to-Digital Converter offers exceptional performance for a wide range of applications, ensuring accurate data conversion with minimal error. Whether you're in industrial automation, telecommunications, or medical equipment, this innovative product delivers value and efficiency. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the ADS6145IRHB25 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures that the package is durable and resistant to environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Bits: 14

With 14 bits of resolution, this ADC can provide high accuracy in converting analog signals to digital, making it ideal for precise measurements and data acquisition.

Maximum Linearity Error (EL): 0.0275%

The low linearity error ensures that the converted digital output closely matches the input analog signal, leading to more accurate and reliable data conversion.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with a wide range of systems and power sources, providing flexibility in usage.

No. of Terminals: 32

Having 32 terminals allows for multiple input/output channels and connections, enabling the ADC to handle a variety of signals simultaneously.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this ADC can withstand harsh environmental conditions and maintain performance in demanding applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, fast operation, and compatibility with digital systems, making it an efficient choice for data conversion.

Technical Specifications

Analog-to-Digital Converters ADS6145IRHB25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0275 %

Sample Rate:

125 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC32,.2SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6145IRHB25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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