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ADS6142IRHB25

Texas Instruments

ADS6142IRHB25 by Texas Instruments

The Texas Instruments ADS6142IRHB25 is a 14-bit ADC with 65 MHz sample rate and 0.0244% linearity error. It operates at -40 to 85°C, ideal for industrial applications. The converter supports binary output codes and has a max analog input voltage of 2V, making it suitable for various precision measurement systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,440 parts In-Stock

1+ parts

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7,440

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Digiode

USA . 2,148 parts In-Stock

1+ parts

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2,148

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 231 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

-

10k+ parts

$0.179

231

$0.186

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-

$0.179

Northwest PG Solutions

USA . 797 parts In-Stock

1+ parts

$0.205

100+ parts

-

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$0.180

797

$0.205

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$0.180

One Stop Electronics

USA . 1,172 parts In-Stock

1+ parts

$7.000

100+ parts

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1,172

$7.000

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AZTECH Wire

Italy . 383 parts In-Stock

1+ parts

$16.030

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383

$16.030

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Parana Technologies

USA . 240 parts In-Stock

1+ parts

$17.896

100+ parts

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$18.067

10k+ parts

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240

$17.896

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$18.067

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ChromeModa Solutions

Germany . 2,608 parts In-Stock

1+ parts

$20.108

100+ parts

$16.489

1k+ parts

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2,608

$20.108

$16.489

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IDEA Electronic Components Group

UK . 2,017 parts In-Stock

1+ parts

$20.108

100+ parts

$19.103

1k+ parts

$18.097

10k+ parts

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2,017

$20.108

$19.103

$18.097

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Microchip USA

USA . 2,866 parts In-Stock

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2,866

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Corphita

USA . 1,296 parts In-Stock

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1,296

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DigiPath Technology Company

USA . 1,212 parts In-Stock

1+ parts

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100+ parts

$18.129

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1,212

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$18.129

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Overview

Experience unparalleled precision and reliability with the ADS6142IRHB25 Analog-to-Digital Converter by Texas Instruments. Crafted with top-quality materials and cutting-edge technology, this device offers a seamless conversion process for a wide range of applications in various industries. From industrial automation to telecommunications, the ADS6142IRHB25 provides exceptional performance, ensuring accurate results every time. Trust Texas Instruments for superior quality and unlock a world of possibilities with this innovative converter.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 14

Higher number of bits allows for more precise and accurate conversion of analog signals to digital data.

Maximum Linearity Error (EL): 0.0244 %

Low linearity error ensures that the output digital data closely matches the input analog signal, improving accuracy.

Sample Rate: 65 MHz

High sample rate allows for fast and efficient conversion of analog signals, making the product suitable for applications requiring real-time data conversion.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Analog-to-Digital Converters ADS6142IRHB25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

65 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC32,.2SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6142IRHB25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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